1. Overview

Optical inspection equipment cameras are specialized imaging devices designed for precision detection and analysis in industrial and scientific applications. By converting optical signals into digital data, these cameras enable automated quality control, defect detection, and process monitoring. Their importance in modern manufacturing and R&D environments stems from their ability to ensure product consistency, reduce human error, and accelerate production speeds.

2. Main Types and Functional Classification

3. Structure and Components

Typical physical structure includes:

• Lens assembly (C /TC mount, adjustable aperture)
• Image sensor (CCD/CMOS with microlens array)
• Image processing unit (FPGA/DSP for real-time algorithms)
• Communication interface (GigE Vision/USB3.0/Camera Link)
• Environmental protection housing (IP65/67 rating)

Technical composition involves: Optical filtering modules, temperature-controlled sensor chambers, and embedded machine vision libraries.

4. Key Technical Specifications

5. Application Fields

• Electronics manufacturing: AOI systems for SMT solder paste inspection
• Automotive industry: Engine component dimensional measurement
• Semiconductor: Wafer micro-crack detection (sub- m resolution)
• Pharmaceuticals: Tablet coating integrity analysis
• Lithium battery production: Electrode sheet defect detection (0.01mm precision)

6. Leading Manufacturers and Products

7. Selection Recommendations

Key consideration factors:

• Match sensor resolution to minimum defect size (e.g., 5 m defects require 5MP camera)
• Calculate required frame rate using formula: Frame Rate (Production Speed FOV Width) / (Sensor Width 0.8)
• Select spectral response based on material properties (e.g., SWIR for silicon wafer imaging)
• Environmental adaptation (temperature/humidity/vibration resistance)
• Total system cost (including lenses, lighting, and processing hardware)

Example: For lithium battery electrode inspection at 2m/s with 10 m defect detection, select a 5MP camera with 100fps frame rate and telecentric lens.

8. Industry Trend Analysis

Key development trends:

• Resolution advancement: 200+MP sensors entering mass production
• AI integration: On-camera neural processing units (NPUs) for edge computing
• Spectral fusion: Multi/hyperspectral imaging becoming standard
• Miniaturization: Wafer-level lens technologies reducing camera size
• Standardization: Emergence of MIPI A-PHY for automotive vision systems

Market forecasts indicate a CAGR of 8.2% through 2030, driven by semiconductor and EV manufacturing demands.