Accessories

Part Number	Description / PDF	Quantity
35-07-10-000 Excelitas Technologies	CAMERA TUBE CLAMP	11
35-05-00-000 Excelitas Technologies	STEPPER CONTROLLER OEM BOARD	1
B90 Excelitas Technologies	BASIC MODULE W/ 90MM WD	30
805-00040 Excelitas Technologies	X-Cite light guide	5
30-17-37-000 Excelitas Technologies	CONTROLLER-N.AMERICA POWER CORD	1
35-07-04-000 Excelitas Technologies	FLUORESCENCE ACCESSORY, FUSION U	1
35-04-33-000 Excelitas Technologies	LOWER FUNC. MOD. COAX FOC. STEPP	1
35-41-60-000 Excelitas Technologies	12.5:1 ZOOM STEPPER MOTORIZED	0
35-01-00-000 Excelitas Technologies	LOWER FUNC. MOD. BASIC	2
35-08-04-000 Excelitas Technologies	CAMERA TUBE,.8X 160FL	6
35-07-00-000 Excelitas Technologies	MIRROR CUBE	0
FTM350 Excelitas Technologies	FIXED TUBE MINI, 350	24
35-04-03-000 Excelitas Technologies	LOWER FUNC. MOD. COAX ANALYZER	1
35-08-02-000 Excelitas Technologies	CAMERA TUBE,.6X 120FL	1
810-00033X Excelitas Technologies	X-Cite adaptor	1
35-08-15-000 Excelitas Technologies	MINI CAMERA TUBE, 2.5X 500FL	2
35-07-14-000 Excelitas Technologies	TUBE CLAMP MOUNT 76MM	1
45-08-06-000 Excelitas Technologies	1X 200FL SWIR CAMERA TUBE	2
35-05-20-000 Excelitas Technologies	STEPPER CONTROLLER	0
33-03-63-000 Excelitas Technologies	ZM125 LOWER MODULE AND FMOS COUP	10

Accessories

1. Overview

Optical inspection equipment accessories are modular components that enhance the functionality, precision, and adaptability of optical inspection systems. These accessories include illumination sources, lenses, sensors, filters, and software modules. They play a critical role in industrial quality control, semiconductor manufacturing, biomedical imaging, and precision measurement by enabling accurate defect detection, dimensional analysis, and material characterization.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Intensity LED Lighting	Uniform illumination, adjustable wavelength, low thermal emission	Surface defect detection in PCB manufacturing
Telecentric Lenses	Minimize perspective errors, maintain constant magnification	Precision metrology in semiconductor wafer inspection
Hyperspectral Imaging Sensors	Capture spectral and spatial data simultaneously	Material analysis in food quality control
Optical Filters	Selective wavelength transmission/reflection	Fluorescence imaging in biomedical diagnostics
Motorized XY Stages	High-precision positioning with sub-micron resolution	Automated sample scanning in R&D laboratories

3. Structural and Technical Composition

A typical accessory system consists of:
- Mechanical housing with vibration-damping mounts
- Optical components (lenses, prisms, diffraction gratings)
- Electronic control units with interface ports (USB 3.0, GigE Vision)
- Calibration modules for environmental compensation
- Software development kits (SDKs) for system integration

4. Key Technical Specifications

Parameter	Description	Importance
Resolution	Minimum detectable feature size (1-10 m range)	Determines defect detection capability
Wavelength Range	Operational spectral band (UV-VIS-NIR: 200-2500 nm)	Material interaction specificity
Working Distance	Optimal object-to-lens distance (10-200 mm)	System design flexibility
Data Transfer Rate	Up to 10 Gbps via CoaXPress interfaces	Real-time inspection throughput
Environmental Tolerance	Operating temperature (0-50 C), humidity resistance	System reliability in industrial settings

5. Application Fields

Semiconductor manufacturing (wafer defect inspection)
Electronics assembly (AOI systems for solder joint analysis)
Medical diagnostics (digital pathology scanners)
Automotive industry (surface finish measurement)
Pharmaceutical packaging (print quality verification)

6. Leading Manufacturers and Representative Products

Manufacturer	Product Series	Key Specifications
Keyence	CV-X4 Series Controllers	Multi-sensor fusion, 0.1 m resolution
Cognex	DVT Summit Series	Embedded vision systems with AI algorithms
Olympus	Stream Essentials Software	3D surface analysis for metallurgy
CCS Opto	LDR2-50SW2 Lighting	Strobe synchronization at 50,000 lx output

7. Selection Recommendations

Key considerations include:
- Matching numerical aperture (NA) with required depth of field
- Spectral compatibility between light sources and sensors
- Environmental sealing (IP ratings for dusty/humid environments)
- Software API compatibility with existing automation systems
- Calibration certification (NIST traceability preferred)

8. Industry Trends Analysis

Current development trends include:
- Integration of AI-powered defect classification algorithms
- Miniaturization through MEMS-based optical components
- Multi-spectral imaging combining visible and thermal IR bands
- Standardization of plug-and-play interfaces (USB4 Vision, XCP)