Accessories

Part Number	Description / PDF	Quantity
C130 Excelitas Technologies	COAX ILLUM MODULE W/ 130MM WD	5
FTM300 Excelitas Technologies	FIXED TUBE MINI, 300	2
FC90 Excelitas Technologies	FOCUS & COAX MODULE W/ 90MM WD	2
35-07-11-000 Excelitas Technologies	INLINE MOUNT	0
35-07-20-000 Excelitas Technologies	APERTURE SET	3
810-00032X Excelitas Technologies	X-Cite adaptor	1
F30 Excelitas Technologies	INTL FOCUS MODULE W/ 30MM WD	1
30-12-00-000 Excelitas Technologies	BASIC LOWER MODULE	6
45-08-13-000 Excelitas Technologies	1.5X 300FL MINI CAMERA TUBE, SWI	3
35-30-02-000 Excelitas Technologies	KIT, CONVERSION, DETENT COVER	1
810-00038X Excelitas Technologies	X-Cite adaptor	1
299066-304 Excelitas Technologies	FMOS/ZM70 LOWER MODULE COUPLER	10
805-00038 Excelitas Technologies	X-Cite light guide	29
35-04-10-000 Excelitas Technologies	LOWER FUNC. MOD. COAX 5MM FOCUS	3
29-69-02-000 Excelitas Technologies	POLARIZER	1
30-16-01-000 Excelitas Technologies	10MM FIBER OPTIC ADAPTER	7
35-07-02-000 Excelitas Technologies	MIRROR CUBE ADAPTER	1
810-00030X Excelitas Technologies	X-Cite adaptor	1
35-07-40-000 Excelitas Technologies	LED RING LIGHT ADAPTER	1
C30 Excelitas Technologies	COAX ILLUM MODULE W/ 30MM WD	4

Accessories

1. Overview

Optical inspection equipment accessories are modular components that enhance the functionality, precision, and adaptability of optical inspection systems. These accessories include illumination sources, lenses, sensors, filters, and software modules. They play a critical role in industrial quality control, semiconductor manufacturing, biomedical imaging, and precision measurement by enabling accurate defect detection, dimensional analysis, and material characterization.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Intensity LED Lighting	Uniform illumination, adjustable wavelength, low thermal emission	Surface defect detection in PCB manufacturing
Telecentric Lenses	Minimize perspective errors, maintain constant magnification	Precision metrology in semiconductor wafer inspection
Hyperspectral Imaging Sensors	Capture spectral and spatial data simultaneously	Material analysis in food quality control
Optical Filters	Selective wavelength transmission/reflection	Fluorescence imaging in biomedical diagnostics
Motorized XY Stages	High-precision positioning with sub-micron resolution	Automated sample scanning in R&D laboratories

3. Structural and Technical Composition

A typical accessory system consists of:
- Mechanical housing with vibration-damping mounts
- Optical components (lenses, prisms, diffraction gratings)
- Electronic control units with interface ports (USB 3.0, GigE Vision)
- Calibration modules for environmental compensation
- Software development kits (SDKs) for system integration

4. Key Technical Specifications

Parameter	Description	Importance
Resolution	Minimum detectable feature size (1-10 m range)	Determines defect detection capability
Wavelength Range	Operational spectral band (UV-VIS-NIR: 200-2500 nm)	Material interaction specificity
Working Distance	Optimal object-to-lens distance (10-200 mm)	System design flexibility
Data Transfer Rate	Up to 10 Gbps via CoaXPress interfaces	Real-time inspection throughput
Environmental Tolerance	Operating temperature (0-50 C), humidity resistance	System reliability in industrial settings

5. Application Fields

Semiconductor manufacturing (wafer defect inspection)
Electronics assembly (AOI systems for solder joint analysis)
Medical diagnostics (digital pathology scanners)
Automotive industry (surface finish measurement)
Pharmaceutical packaging (print quality verification)

6. Leading Manufacturers and Representative Products

Manufacturer	Product Series	Key Specifications
Keyence	CV-X4 Series Controllers	Multi-sensor fusion, 0.1 m resolution
Cognex	DVT Summit Series	Embedded vision systems with AI algorithms
Olympus	Stream Essentials Software	3D surface analysis for metallurgy
CCS Opto	LDR2-50SW2 Lighting	Strobe synchronization at 50,000 lx output

7. Selection Recommendations

Key considerations include:
- Matching numerical aperture (NA) with required depth of field
- Spectral compatibility between light sources and sensors
- Environmental sealing (IP ratings for dusty/humid environments)
- Software API compatibility with existing automation systems
- Calibration certification (NIST traceability preferred)

8. Industry Trends Analysis

Current development trends include:
- Integration of AI-powered defect classification algorithms
- Miniaturization through MEMS-based optical components
- Multi-spectral imaging combining visible and thermal IR bands
- Standardization of plug-and-play interfaces (USB4 Vision, XCP)