Memory - Modules

Image	Part Number	Description / PDF	Quantity	Rfq
	AW12M7218BLK0MW ATP Electronics, Inc.	MODULE DDR3 SDRAM 4GB 204SODIMM	0
	AW12M7218BLF8S ATP Electronics, Inc.	MEMORY MODULE 4GB 204UDIMM	0
	AQ12P72D8BLK0M ATP Electronics, Inc.	MEMORY MODULE 4GB 240PIN UNBUFF	0
	AW12M6438BLF8S ATP Electronics, Inc.	MEMORY MODULE 4GB 204UDIMM	0
	A4D16QB8BNPBSE ATP Electronics, Inc.	MODULE DDR4 SDRAM 16GB 2400MT/S	0
	75.B83CG.G040B Apacer	DDR3-1333 IND 4GB SODIMM	0
	MTA18ASF2G72PZ-2G6D1 Micron Technology	MODULE DDR4 SDRAM 16GB 288RDIMM	0
	AQ12P72D8BLH9S ATP Electronics, Inc.	MEMORY MODULE 4GB 240PIN UNBUFF	0
	78.C1GM4.4010B Apacer	DDR4 8GB SDRAM UDIMM	0
	AW12P64B8BLMAMW ATP Electronics, Inc.	MODULE DDR3 SDRAM 4GB 1866MT/S	0
	AW24M7248BLK0M ATP Electronics, Inc.	MEMORY MODULE 8GB 204RDIMM	0
	MTA36ASF8G72PZ-3G2B2 Micron Technology	DDR4 64GB RDIMM	0
	AW12M6438BLH9S ATP Electronics, Inc.	MEMORY MODULE 4GB 204UDIMM	0
	AQ56M64A8BKK0M ATP Electronics, Inc.	MEMORY MODULE 2GB 240PIN UNBUFF	0
	MTA16ATF4G64HZ-2G6B2 Micron Technology	MOD SDRAM DDR4 16GB UDIMM	0
	AQ12M72X8BLH9M ATP Electronics, Inc.	MEMORY MODULE 4GB 240PIN UNBUFF	0
	SQR-UD3N4G1K6SEEEB Advantech	MODULE DDR3 SDRAM 4GB 204SODIMM	0
	MTA16ATF2G64AZ-2G6E1 Micron Technology	MODULE DDR4 16GB UDIMM	0
	MTA9ASF2G72PZ-3G2B1 Micron Technology	DDR4 16GB RDIMM	0
	AW56P7258BKH9M ATP Electronics, Inc.	MEMORY MODULE 2GB 204RDIMM	0

Memory - Modules

1. Overview

Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
SD/microSD Cards	Portable flash memory with varying speed classes (UHS-I/II, V30/V60)	Smartphones, drones, action cameras
CFexpress Cards	High-speed PCIe/NVMe interface, superior durability	Professional DSLR cameras, video production
DRAM Modules	Volatile memory with fast access rates (DDR4/DDR5 SDRAM)	Computers, servers, gaming consoles
NAND Flash Modules	Non-volatile storage with MLC/TLC configurations	SSDs, industrial controllers
MRAM Modules	Non-volatile, low-power magnetic storage technology	Aerospace, IoT edge devices

3. Structure and Composition

Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	1GB-1TB for cards, 1GB-256GB per module	Determines data volume handling capability
Read/Write Speed	10-1000+ MB/s sequential, 10k-1M IOPS random	Affects system responsiveness
Endurance	1000-100,000 P/E cycles	Dictates product lifespan
Operating Temperature	-25 C to +85 C industrial grade	Ensures reliability in harsh environments
Interface Protocol	SD UHS-II, NVMe 1.4, DDR5	Defines compatibility and bandwidth

5. Application Areas

Consumer Electronics: Smartphones (UFS cards), gaming consoles (custom SSD modules)
Industrial Automation: PLC controllers (industrial CFast cards), data loggers
Automotive: ADAS systems (AEC-Q100 qualified NAND), infotainment units
Healthcare: Medical imaging equipment (high-reliability SD cards)
Enterprise: Data center SSDs (3D XPoint memory modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Samsung	980 Pro NVMe SSD	7000 MB/s read, PCIe 4.0, TBW: 1200
Kingston	FURY DDR5 RGB DIMM	4800-6000 MT/s, XMP 3.0 support
SanDisk	Extreme Pro CFexpress 2.0	1700 MB/s, 10,000 write cycles
SK hynix	CRONI-DX DDR4	32GB RDIMM, 2666MHz, ECC
Western Digital	WD_BLACK SN850X	Gen4 controller, 7300 MB/s, HMB feature

7. Selection Recommendations

Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.

8. Industry Trends

Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)