Memory - Modules

Part Number	Description / PDF	Quantity
WD4SE8008G24TSE Wintec Industries	260-SODM 8GB DDR4-2400 512X8 ECC	5
78.A1GDE.4000C Apacer	2GB DDR3 1333 U-DIMM 256X8 1 RAN	1
SP008GILFU266BH0 Silicon Power	DDR4 UDIMM 2666C19 1GX8 8GB	10
SP004GISLU160NH0 Silicon Power	DDR3 SODIMM 1600C11 512MX8 4GB	10
A4F16QG8BNWEME ATP Electronics, Inc.	DDR4-3200 260P 16GB UNB ECC DIMM	8
SP002GISLU160WH0 Silicon Power	DDR3 SODIMM 1600C11 256MX16 2GB	10
M40GTQHFL-RA000-D	1GB SLC USB EMBEDDED 3.1 MODULE	0
A4B08QG8BNPBSE ATP Electronics, Inc.	MODULE DDR4 SDRAM 4GB 288RDIMM	3
VR7PU127298HBDMET Viking Technology	MODULE DDR3 SDRAM 4GB 204SODIMM	10
WD2SN02GX816-667G-PF Wintec Industries	MODULE DDR2 SDRAM 2GB 200SODIMM	0
78.A2GF7.4000B Apacer	2GB DDR4 SDRAM SO-DIMM	6
78.B1GEP.4000C Apacer	4GB DDR3 1333 U-DIMM 512X8 1 RAN	5
DD2.22260S.001 Apacer	DDR4 2400 16GB XR-DIMM 16GB, CON	5
MT16KTF1G64AZ-1G9P1 Micron Technology	MODULE DDR3L SDRAM 8GB 240UDIMM	76
AW56P7218BKK0M ATP Electronics, Inc.	MODULE DDR3L SDRAM 2GB 204SODIMM	3
78.A1GN3.4010B Apacer	2GB DDR4 SDRAM UDIMM	5
A4D08QA8BNWEME ATP Electronics, Inc.	DDR4-3200 288P 8GB UNB NON-ECC D	6
WD4RE4016G24MSC Wintec Industries	288-DMD4 16GB DDR4-2400 RDIMM EC	5
78.A1GE3.4000C Apacer	2GB DDR3 1600 U-DIMM 256X8 1 RAN	5
SP002GISLU160VH0 Silicon Power	DDR3 SODIMM 1600C11 256MX8 2GB	10

Memory - Modules

1. Overview

Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
SD/microSD Cards	Portable flash memory with varying speed classes (UHS-I/II, V30/V60)	Smartphones, drones, action cameras
CFexpress Cards	High-speed PCIe/NVMe interface, superior durability	Professional DSLR cameras, video production
DRAM Modules	Volatile memory with fast access rates (DDR4/DDR5 SDRAM)	Computers, servers, gaming consoles
NAND Flash Modules	Non-volatile storage with MLC/TLC configurations	SSDs, industrial controllers
MRAM Modules	Non-volatile, low-power magnetic storage technology	Aerospace, IoT edge devices

3. Structure and Composition

Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	1GB-1TB for cards, 1GB-256GB per module	Determines data volume handling capability
Read/Write Speed	10-1000+ MB/s sequential, 10k-1M IOPS random	Affects system responsiveness
Endurance	1000-100,000 P/E cycles	Dictates product lifespan
Operating Temperature	-25 C to +85 C industrial grade	Ensures reliability in harsh environments
Interface Protocol	SD UHS-II, NVMe 1.4, DDR5	Defines compatibility and bandwidth

5. Application Areas

Consumer Electronics: Smartphones (UFS cards), gaming consoles (custom SSD modules)
Industrial Automation: PLC controllers (industrial CFast cards), data loggers
Automotive: ADAS systems (AEC-Q100 qualified NAND), infotainment units
Healthcare: Medical imaging equipment (high-reliability SD cards)
Enterprise: Data center SSDs (3D XPoint memory modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Samsung	980 Pro NVMe SSD	7000 MB/s read, PCIe 4.0, TBW: 1200
Kingston	FURY DDR5 RGB DIMM	4800-6000 MT/s, XMP 3.0 support
SanDisk	Extreme Pro CFexpress 2.0	1700 MB/s, 10,000 write cycles
SK hynix	CRONI-DX DDR4	32GB RDIMM, 2666MHz, ECC
Western Digital	WD_BLACK SN850X	Gen4 controller, 7300 MB/s, HMB feature

7. Selection Recommendations

Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.

8. Industry Trends

Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)