Accessories

Part Number	Description / PDF	Quantity
DS9093N+ Maxim Integrated	IBUTTON FOB BLACK	46661900
DS1404+ Maxim Integrated	CABLE CRADLE BLACK	59146
DS1402-BR8+ Maxim Integrated	CABLE 8' BUTTON TO RJ11	393562
DS9093RA+ Maxim Integrated	IBUTTON LOCK	1124816727
DS9093S+ Maxim Integrated	IBUTTON MOUNT 2HOLE	86123700
DS9093AB+ Maxim Integrated	IBUTTON KEY RING MOUNT BLUE	143631700
DS9092L+ Maxim Integrated	IBUTTON PROBE PANEL MOUNT W/LED	4571275
DS9093AY+ Maxim Integrated	IBUTTON KEY RING MOUNT YELLOW	153870600
DS9096P+ Maxim Integrated	IBUTTON ADHESIVE PADS	0
DS1402-BP8+ Maxim Integrated	CABLE 8' BUTTON TO PROBE	701062
DS9093AG+ Maxim Integrated	IBUTTON KEY RING MOUNT GREEN	2445
DS9092T# Maxim Integrated	IBTN PROBE W/TACTILE FEEDBACK	4812622
DS1402-RP8+ Maxim Integrated	CABLE TOUCH & HOLD PROBE	4120
DS9093A+ Maxim Integrated	IBUTTON KEY RING MOUNT BLACK	489772300
DS9093RB+ Maxim Integrated	IBUTTON FLANGE	54811500
DS9093F+ Maxim Integrated	IBUTTON KEY RING MOUNT BLACK	113016603
DS1402-RPL+ Maxim Integrated	CABLE TOUCH & HOLD PROBE	39
DS9092+ Maxim Integrated	IBUTTON PROBE PANEL MOUNT	59971138
DS1402-RP3+ Maxim Integrated	CABLE TOUCH & HOLD PROBE	1071901
DS9100-A+ Maxim Integrated	CONTACT TOUCH AND HOLD	76029890

Accessories

1. Overview

Memory cards, modules, and accessories form a critical component ecosystem for data storage and transfer in modern electronic systems. These products enable persistent storage, rapid data access, and system expandability across consumer, industrial, and enterprise applications. Their evolution directly supports advancements in device miniaturization, AI processing, and high-speed computing.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
SD Cards	Portable flash memory with standard form factor, supports hot-swapping	Digital cameras, drones, automotive infotainment
microSD	Miniaturized SD format with optional UHS-II interface	Smartphones, action cameras, IoT devices
CFast/CFexpress	High-speed interfaces (up to 2GB/s), robust industrial design	Professional video cameras, industrial automation
DRAM Modules	Volatile memory with DDR4/DDR5 interfaces, ECC support	Servers, workstations, gaming PCs
NVMe SSD Modules	PCIe interface, 3D NAND technology, TB-level capacity	Data centers, high-performance computing

3. Structural & Technical Composition

Typical components include:

Memory chips (NAND flash/DRAM) with advanced packaging (e.g., BGA)
Controller IC with wear-leveling and error correction
High-density PCB with optimized signal traces
Protective casing with EMI shielding
Interface connectors (USB 3.2/PCIe 4.0/SATA III)

4. Key Technical Specifications

Parameter	Importance
Storage Capacity (128MB-8TB)	Determines data volume handling capability
Read/Write Speed (10-7000MB/s)	Critical for real-time data processing
Endurance (P/E Cycles: 500-100,000)	Dictates product lifespan in write-intensive scenarios
Operating Temperature (-40 C to 85 C)	Ensures reliability in harsh environments
Power Consumption (0.5-10W)	Key factor for battery-powered devices

5. Application Domains

Primary industries include:

Consumer Electronics: Smartphones, VR headsets, portable gaming
Industrial Automation: PLCs, CNC machines, robotics
Medical Devices: MRI systems, portable diagnostic equipment
Automotive: ADAS systems, telematics, autonomous driving
Aerospace: Flight data recorders, satellite imaging systems

6. Leading Manufacturers & Products

Manufacturer	Representative Product
SanDisk (Western Digital)	Extreme Pro CFexpress Type B (1.7GB/s)
Samsung Electronics	980 Pro NVMe SSD (7000MB/s)
Kingston Technology	DC500R Data Center SSD
Transcend Info.	TS-RDF8K UHS-II SD Card Reader
Corsair Memory	Vengeance LPX DDR4 3200MHz

7. Selection Recommendations

Key considerations:

Match interface standards (e.g., UHS-II for high-speed photography)
Evaluate workload requirements (read/write ratio)
Environmental factors (vibration, temperature extremes)
Compatibility testing with host systems
Total cost of ownership (endurance vs. price tradeoff)

Industry Trend Analysis

Emerging trends include:

Transition to 3D NAND stacking for higher density
Adoption of PCIe 5.0 interface (14GB/s+ bandwidth)
Integration of AI-enabled controllers for predictive maintenance
Growth of industrial-grade memory solutions for IIoT applications
Development of ultra-low-power memory modules for edge computing

Market forecasts predict a CAGR of 6.8% through 2030, driven by automotive ADAS and 5G infrastructure demands.