Accessories

Part Number	Description / PDF	Quantity
DS1402D-DB8+ Maxim Integrated	CABLE 8' BLUE DOT TO BUTTON	246435
DS1402D-DR8+ Maxim Integrated	CABLE 8' BLUE DOT TO RJ11	1134
DS9093AR+ Maxim Integrated	IBUTTON KEY RING MOUNT RED	103714200
DS9107+ Maxim Integrated	IC IBUTTON CAPSULE BLACK	292126
DS1401-4+ Maxim Integrated	HOLDER IBUTTON FRONT PANEL	0
DS9106S-YL0+ Maxim Integrated	IBUTTON HALO YELLOW 20MM	0
DS9101+ Maxim Integrated	IBUTTON MULTIPURPOSE CLIP	0
DS1402-BP3+ Maxim Integrated	CABLE 3' IBUTTON TO PROBE	0
DS9106L-PK0+ Maxim Integrated	IBUTTON HALO PINK 60MM	0
DS9106S-BL0+ Maxim Integrated	IBUTTON HALO BLUE 20MM	0
DS9106L-0G0+ Maxim Integrated	IBUTTON HALO ORANGE 60MM	0
DS9106L-YL0+ Maxim Integrated	IBUTTON HALO YELLOW 60MM	0
DS9106L-WH0+ Maxim Integrated	IBUTTON HALO WHITE 60MM	0
DS9106S-0G0+ Maxim Integrated	IBUTTON HALO ORANGE 20MM	0

Accessories

1. Overview

Memory cards, modules, and accessories form a critical component ecosystem for data storage and transfer in modern electronic systems. These products enable persistent storage, rapid data access, and system expandability across consumer, industrial, and enterprise applications. Their evolution directly supports advancements in device miniaturization, AI processing, and high-speed computing.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
SD Cards	Portable flash memory with standard form factor, supports hot-swapping	Digital cameras, drones, automotive infotainment
microSD	Miniaturized SD format with optional UHS-II interface	Smartphones, action cameras, IoT devices
CFast/CFexpress	High-speed interfaces (up to 2GB/s), robust industrial design	Professional video cameras, industrial automation
DRAM Modules	Volatile memory with DDR4/DDR5 interfaces, ECC support	Servers, workstations, gaming PCs
NVMe SSD Modules	PCIe interface, 3D NAND technology, TB-level capacity	Data centers, high-performance computing

3. Structural & Technical Composition

Typical components include:

Memory chips (NAND flash/DRAM) with advanced packaging (e.g., BGA)
Controller IC with wear-leveling and error correction
High-density PCB with optimized signal traces
Protective casing with EMI shielding
Interface connectors (USB 3.2/PCIe 4.0/SATA III)

4. Key Technical Specifications

Parameter	Importance
Storage Capacity (128MB-8TB)	Determines data volume handling capability
Read/Write Speed (10-7000MB/s)	Critical for real-time data processing
Endurance (P/E Cycles: 500-100,000)	Dictates product lifespan in write-intensive scenarios
Operating Temperature (-40 C to 85 C)	Ensures reliability in harsh environments
Power Consumption (0.5-10W)	Key factor for battery-powered devices

5. Application Domains

Primary industries include:

Consumer Electronics: Smartphones, VR headsets, portable gaming
Industrial Automation: PLCs, CNC machines, robotics
Medical Devices: MRI systems, portable diagnostic equipment
Automotive: ADAS systems, telematics, autonomous driving
Aerospace: Flight data recorders, satellite imaging systems

6. Leading Manufacturers & Products

Manufacturer	Representative Product
SanDisk (Western Digital)	Extreme Pro CFexpress Type B (1.7GB/s)
Samsung Electronics	980 Pro NVMe SSD (7000MB/s)
Kingston Technology	DC500R Data Center SSD
Transcend Info.	TS-RDF8K UHS-II SD Card Reader
Corsair Memory	Vengeance LPX DDR4 3200MHz

7. Selection Recommendations

Key considerations:

Match interface standards (e.g., UHS-II for high-speed photography)
Evaluate workload requirements (read/write ratio)
Environmental factors (vibration, temperature extremes)
Compatibility testing with host systems
Total cost of ownership (endurance vs. price tradeoff)

Industry Trend Analysis

Emerging trends include:

Transition to 3D NAND stacking for higher density
Adoption of PCIe 5.0 interface (14GB/s+ bandwidth)
Integration of AI-enabled controllers for predictive maintenance
Growth of industrial-grade memory solutions for IIoT applications
Development of ultra-low-power memory modules for edge computing

Market forecasts predict a CAGR of 6.8% through 2030, driven by automotive ADAS and 5G infrastructure demands.