Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B65878E0012D001 TDK EPCOS	BOBBIN COIL FORMER PQ 26 X 20	571
CLM-E14/PLT14 FERROXCUBE	U SHAPED CLIP	8617
CP-P18/11-2S FERROXCUBE	COIL FORMER	2659
CLM/TP-P26/16-C FERROXCUBE	U SHAPED CLIP	548
CLA-E42/21/15 FERROXCUBE	CLAMP	28
B64293A1200X000 TDK EPCOS	BASE PLATE TOROIDS	74
B66366W1018T001 TDK EPCOS	BOBBIN COIL FORMER ETD 44X22X15	241
B65806B2203X000 TDK EPCOS	CLAMP RM 5	13164
SPR-EP17 FERROXCUBE	SPRING	329
B66208A2010X000 TDK EPCOS	YOKE E 25 X 13 X 7	9048
B65848D1010D001 TDK EPCOS	BOBBIN COIL FORMER EP 20	40
9643001165 Fair-Rite Products Corp.	43 BOBBIN GROUND	4115
B65679E0002X022 TDK EPCOS	ADJUSTMENT SCREW P 26 X 16	2502
B65545B0009X000 TDK EPCOS	YOKE P 14 X 8	357
B66364A2000X000 TDK EPCOS	YOKE ETD 39 X 20 X 13	1065
SPR-P42/29 FERROXCUBE	SPRING	40
CLI/P-RM10/ILP FERROXCUBE	CLIP	7068
CPV-RM8/I-1S-12PD-TZ FERROXCUBE	COIL FORMER VERTICAL	865
B65539C1003X001 TDK EPCOS	ADJUSTMENT SCREW RM 5	1004
B65539C1002X022 TDK EPCOS	ADJUSTMENT SCREW RM 5	1031

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.