Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B65655B0010X000 TDK EPCOS	MOUNTING ASSEMBLY P 18 X 11	236
B65848S2000X000 TDK EPCOS	MOUNTING ASSEMBLY EP 20	122
B66206C1014T001 TDK EPCOS	BOBBIN COIL FORMER E 20 X 10 X 6	673
9677001165 Fair-Rite Products Corp.	77 BOBBIN GROUND	12614
CPV-PQ26/20-1S-12P-Z FERROXCUBE	COIL FORMER VERTICAL	958
B65542B0000T001 TDK EPCOS	BOBBIN COIL FORMER P 14 X 8	2002
B66368W1020T001 TDK EPCOS	BOBBIN COIL FORMER ETD 49X25X16	60
CPV-P22/13-1S-6PD-Z FERROXCUBE	COIL FORMER VERTICAL	499
CPV-RM10/I-1S-12PD FERROXCUBE	COIL FORMER VERTICAL	163
B65822F1008T001 TDK EPCOS	BOBBIN COIL FORMER RM 5	0
BPL/D-CLM/C-P22/13-C FERROXCUBE	BASE PLATE	0
SPR-P18/11 FERROXCUBE	SPRING	265
CLM-E22/PLT22 FERROXCUBE	U SHAPED CLIP	11378
CSH-E25/13/7-1S-8P-C FERROXCUBE	COIL FORMER HORIZONTAL	290
B65814N1008D001 TDK EPCOS	BOBBIN COIL FORMER RM 10	985
B65675B0005X000 TDK EPCOS	MOUNTING ASSEMBLY P 26 X 16	520
CSH-EP20-2S-10P-T FERROXCUBE	COIL FORMER HORIZONTAL	3248
B66424W1012D001 TDK EPCOS	BOBBIN COIL FORMER EFD 30X15X9	3723
B66308A2010X000 TDK EPCOS	YOKE E 16 X 8 X 5	1317
B66362B1014T001 TDK EPCOS	BOBBIN COIL FORMER ETD 34X17X11	639

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.