Bobbins (Coil Formers), Mounts, Hardware

Image	Part Number	Description / PDF	Quantity	Rfq
	B65806P1006D001 TDK EPCOS	BOBBIN COIL FORMER RM 5	0
	B65804D1006D001 TDK EPCOS	BOBBIN COIL FORMER RM 4	0
	B65808A5000X000 TDK EPCOS	INSULATING WASHER RM 6	0
	B65806A5000X000 TDK EPCOS	INSULATING WASHER RM 5	0
	B66272J1013T001 TDK EPCOS	BOBBIN COIL FORMER EC 35X17X10	0
	B65806P1004D001 TDK EPCOS	BOBBIN COIL FORMER RM 5	0
	B65814P1012D001 TDK EPCOS	BOBBIN COIL FORMER RM 10	0
	B65812P1005D001 TDK EPCOS	BOBBIN COIL FORMER RM 8	0
	B65812P1008D001 TDK EPCOS	BOBBIN COIL FORMER RM 8	0
	CPV-RM8/I-1S-12PD FERROXCUBE	COIL FORMER VERTICAL	0
	B65812A5000X000 TDK EPCOS	INSULATING WASHER RM 8	0
	B65812P1008D002 TDK EPCOS	BOBBIN COIL FORMER RM 8	0
	B65806P1005D001 TDK EPCOS	BOBBIN COIL FORMER RM 5	0
	B66348A1018T1 TDK EPCOS	BOBBIN COIL FORMER ER 42X22X15	0
	WAS-CLM/C-P14/8 FERROXCUBE	WASHER	0
	B65808P1005D001 TDK EPCOS	BOBBIN COIL FORMER RM 6	0
	B65804P1005D001 TDK EPCOS	BOBBIN COIL FORMER RM 4	0
	CPH-E19/8/5-2S-4P-C FERROXCUBE	COIL FORMER HORIZONTAL	0
	B65820A5000X000 TDK EPCOS	INSULATING WASHER RM 7	0
	WAS-CLM/S-P26/16 FERROXCUBE	WASHER	0

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.