Discrete Assortment Kits

Image Part Number Description / PDF Quantity Rfq
353-8001-KIT

353-8001-KIT

Micro Commercial Components (MCC)

KIT 10EA OF 26 POPULAR SS DIODES

0

SP000410804

SP000410804

IR (Infineon Technologies)

KIT SAMPLE FOR GEN PURP RF TRANS

0

Q2951220

Q2951220

Micro Commercial Components (MCC)

KIT 10EA 15 POPULAR TRANSISITORS

0

SP000410842

SP000410842

IR (Infineon Technologies)

KIT SAMPLE FOR HV/MULTI CHIP

0

SP000410806

SP000410806

IR (Infineon Technologies)

KIT SAMPLE RF FOR RF SWITCHING

0

3806684

3806684

NXP Semiconductors

KIT SCHOTTKY DIODE 17 VALUES

0

MADP-011062-SAMKIT

MADP-011062-SAMKIT

Metelics (MACOM Technology Solutions)

HMIC SWITCHES &SURMOUNTDEVICES S

0

SP000410810

SP000410810

IR (Infineon Technologies)

KIT SAMPLE FOR MIX/DETECT PWRLVL

0

353-8000-KIT

353-8000-KIT

Micro Commercial Components (MCC)

KIT 10EA 18 POPULAR SHTKY DIODES

0

497-8011-KIT

497-8011-KIT

STMicroelectronics

KIT MOSFET AUTOMOTIVE

0

TBU-DESIGNKIT

TBU-DESIGNKIT

J.W. Miller / Bourns

KIT SURGE SUPP 18DEVICES 10EACH

0

SP000410854

SP000410854

IR (Infineon Technologies)

KIT SAMPLE FOR DGTL TRANS 500MA

0

KIT RF DIODE 2

KIT RF DIODE 2

IR (Infineon Technologies)

KIT SAMPLE RF FOR RF APPLICTN

0

3806620

3806620

NXP Semiconductors

KIT BISS TRANSISTORS 17 VALUES

0

SP000410802

SP000410802

IR (Infineon Technologies)

KIT SAMPLE FOR HIGH END SI/SIGE

0

NXPMOSFET-DESIGNKIT

NXPMOSFET-DESIGNKIT

NXP Semiconductors

KIT DESIGN MOSFET LFPAK

0

497-8006A-KIT

497-8006A-KIT

STMicroelectronics

KIT SCHOTTKY DIODE 9VALUES 5EA

0

SP000410852

SP000410852

IR (Infineon Technologies)

KIT SAMPLE DGTL DL TRANS 100MA

0

BG2B-F

BG2B-F

Powerex, Inc.

KIT DEVELOPMENT ACCY GATE DVR

0

Q2321478

Q2321478

STMicroelectronics

KIT TRANSISTOR NPN/PNP 22VAL 5EA

0

Discrete Assortment Kits

1. Overview

KitsDiscrete Assortment Kits refer to standardized electronic component kits containing discrete semiconductor devices. These kits provide essential building blocks for circuit design, enabling rapid prototyping and production across various industries. Their importance stems from their role in power management, signal processing, and system reliability optimization in modern electronics.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Diode KitsHigh-speed switching, reverse voltage protectionPower supplies, rectifiers
Transistor KitsAmplification, switching, voltage regulationAmplifiers, motor drivers
MOSFET KitsLow on-resistance, high-frequency operationPower converters, LED drivers
IGBT KitsHigh voltage/current handlingElectric vehicles, industrial inverters
Thyristor KitsPrecise current controlLighting dimmers, motor controls

3. Structure and Composition

Typical kits contain:

  • Standardized component trays with ESD protection
  • Assorted discrete semiconductors (SMD/through-hole)
  • Technical datasheets and selection guides
  • Color-coded packaging for quick identification
  • Moisture-proof desiccant packs

4. Key Technical Specifications

ParameterImportance
Max Voltage Rating (V)Ensures safe operation under rated loads
Current Capacity (A)Determines power handling capability
Thermal Resistance ( C/W)Impacts heat dissipation efficiency
Switching Frequency (MHz)Affects performance in high-speed applications
Operating Temperature ( C)Defines environmental reliability limits

5. Application Fields

Primary industries:

  • Consumer Electronics (smartphones, wearables)
  • Automotive Electronics (EV powertrains, ADAS)
  • Industrial Automation (PLCs, motor drives)
  • Renewable Energy (solar inverters, energy storage)
  • Telecommunications (5G base stations, optical transceivers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
STMicroelectronicsMasterGan4 GaN Kit
Infineon Technologies600V CoolMOS CE Kit
ON SemiconductorFSBB20CH60DF MOSFET Kit
ROHM SemiconductorBare Die SiC Module Kit
Texas InstrumentsGaNFET Power Stage Kit

7. Selection Recommendations

Key considerations:

  • Match voltage/current ratings with system requirements
  • Evaluate thermal management needs
  • Verify package compatibility with PCB design
  • Assess supplier quality certifications
  • Compare price-performance ratios

Industry Trend Analysis

Current trends include:

  • Miniaturization through advanced packaging (e.g., WLCSP)
  • Wide bandgap (WBG) semiconductor adoption (SiC/GaN)
  • Increased integration of protection features
  • AI-driven component selection tools
  • RoHS compliance and eco-friendly materials

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