Discrete Assortment Kits

Image Part Number Description / PDF Quantity Rfq
DIODESKITFS

DIODESKITFS

Sanyo Semiconductor/ON Semiconductor

KIT DIODE 10EA OF 10 VALUES

11

MOSFET1-KIT

MOSFET1-KIT

IR (Infineon Technologies)

20-100V FETS SOT23 10PC 18VALUES

4

353-8004-KIT

353-8004-KIT

Micro Commercial Components (MCC)

KIT ZENER 10EA OF 18 VALUES

7

MOSFET2-KIT

MOSFET2-KIT

IR (Infineon Technologies)

20-100V FETS 150PC(10V 15EACH)

1

NTEKCOM1

NTEKCOM1

NTE Electronics, Inc.

KIT W/30 TOP SELLERS

1

846-1003-KIT

846-1003-KIT

ROHM Semiconductor

KIT MOSFET 5EA OF 16 VALUES

1

846-1001-KIT

846-1001-KIT

ROHM Semiconductor

KIT MOSFET 5EA OF 16 VALUES

0

353-8005-KIT

353-8005-KIT

Micro Commercial Components (MCC)

KIT DIODE 10EA OF 16 SMD VALUES

1

MOSFET4-KIT

MOSFET4-KIT

IR (Infineon Technologies)

30-100V SO8/PQFN5X6/PQFN3X3 80PC

2

CD-LAB2

CD-LAB2

J.W. Miller / Bourns

KIT DIODE SCHOTTKY 10PC

9

MOSFET3-KIT

MOSFET3-KIT

IR (Infineon Technologies)

30V FET PQFN5X6 80PC(30V 10EACH)

3

ZENER KIT

ZENER KIT

Comchip Technology

KIT 30 VALUES/10PC EACH

12

NTEKCOM2

NTEKCOM2

NTE Electronics, Inc.

KIT W/30 TOP SELLERS

0

846-1002-KIT

846-1002-KIT

ROHM Semiconductor

KIT MOSFET 5EA OF 13 VALUES

1

353-8003-KIT

353-8003-KIT

Micro Commercial Components (MCC)

KIT 10EA OF 17 SMD VALUES ZENER

4

FIT0426

FIT0426

DFRobot

ECELL: BREADBOARD-PLUGIN DIODE A

0

CD-LAB6

CD-LAB6

J.W. Miller / Bourns

KIT ESD PROTECTION LAB 10PC

0

497-8012-KIT

497-8012-KIT

STMicroelectronics

KIT MOSFET MD MESH

0

SP000410812

SP000410812

IR (Infineon Technologies)

KIT SAMPLE FOR CURRENT TO 3A

0

MADP-011069-SAMKIT

MADP-011069-SAMKIT

Metelics (MACOM Technology Solutions)

DISCRETE PIN DIODES & LIMITERS S

0

Discrete Assortment Kits

1. Overview

KitsDiscrete Assortment Kits refer to standardized electronic component kits containing discrete semiconductor devices. These kits provide essential building blocks for circuit design, enabling rapid prototyping and production across various industries. Their importance stems from their role in power management, signal processing, and system reliability optimization in modern electronics.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Diode KitsHigh-speed switching, reverse voltage protectionPower supplies, rectifiers
Transistor KitsAmplification, switching, voltage regulationAmplifiers, motor drivers
MOSFET KitsLow on-resistance, high-frequency operationPower converters, LED drivers
IGBT KitsHigh voltage/current handlingElectric vehicles, industrial inverters
Thyristor KitsPrecise current controlLighting dimmers, motor controls

3. Structure and Composition

Typical kits contain:

  • Standardized component trays with ESD protection
  • Assorted discrete semiconductors (SMD/through-hole)
  • Technical datasheets and selection guides
  • Color-coded packaging for quick identification
  • Moisture-proof desiccant packs

4. Key Technical Specifications

ParameterImportance
Max Voltage Rating (V)Ensures safe operation under rated loads
Current Capacity (A)Determines power handling capability
Thermal Resistance ( C/W)Impacts heat dissipation efficiency
Switching Frequency (MHz)Affects performance in high-speed applications
Operating Temperature ( C)Defines environmental reliability limits

5. Application Fields

Primary industries:

  • Consumer Electronics (smartphones, wearables)
  • Automotive Electronics (EV powertrains, ADAS)
  • Industrial Automation (PLCs, motor drives)
  • Renewable Energy (solar inverters, energy storage)
  • Telecommunications (5G base stations, optical transceivers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
STMicroelectronicsMasterGan4 GaN Kit
Infineon Technologies600V CoolMOS CE Kit
ON SemiconductorFSBB20CH60DF MOSFET Kit
ROHM SemiconductorBare Die SiC Module Kit
Texas InstrumentsGaNFET Power Stage Kit

7. Selection Recommendations

Key considerations:

  • Match voltage/current ratings with system requirements
  • Evaluate thermal management needs
  • Verify package compatibility with PCB design
  • Assess supplier quality certifications
  • Compare price-performance ratios

Industry Trend Analysis

Current trends include:

  • Miniaturization through advanced packaging (e.g., WLCSP)
  • Wide bandgap (WBG) semiconductor adoption (SiC/GaN)
  • Increased integration of protection features
  • AI-driven component selection tools
  • RoHS compliance and eco-friendly materials

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