| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
KIT IGRID 2.00MM DR V 20-28 PIN |
0 |
|
 |
Woodhead - Molex |
KIT CONN SLIMSTACK .635MM BTB |
1 |
|
 |
Woodhead - Molex |
KIT CONN MINI-FIT JR 6 CIRC VERT |
12 |
|
 |
Woodhead - Molex |
KIT WMLX-141 |
4 |
|
 |
Woodhead - Molex |
KIT CONN MINI-FIT JR 12 CIR VERT |
0 |
|
 |
Woodhead - Molex |
KIT INDUSTRIAL USB TYPE A&B |
0 |
|
 |
Woodhead - Molex |
KIT PICOFLEX VERT 1.27MM ASSORTE |
0 |
|
 |
Woodhead - Molex |
KIT WMLX-272 |
1 |
|
 |
Woodhead - Molex |
KIT WMLX-262 |
3 |
|
 |
Woodhead - Molex |
KIT SMT VERT HDR ZIF FLIP-TYPE |
6 |
|
 |
Woodhead - Molex |
KIT .156 KK SERIES 6 CIRC |
3 |
|
 |
Woodhead - Molex |
KIT CONN Z-POWER & RING TERM |
1 |
|
 |
Woodhead - Molex |
KIT CONN STD .062" SERIES |
77 |
|
 |
Woodhead - Molex |
KIT .156 KK SERIES 3 CIRC RAMP |
22 |
|
 |
Woodhead - Molex |
KIT RJ45 ETHERNET |
1 |
|
 |
Woodhead - Molex |
KIT WMLX-275 |
1 |
|
 |
Woodhead - Molex |
KIT BNC VERT & R/A RECP RF |
1 |
|
 |
Woodhead - Molex |
KIT CONN .100 KK SERIES 8 CIRC |
2 |
|
 |
Woodhead - Molex |
KIT PICOFLEX ALL INCLUSIVE |
2 |
|
 |
Woodhead - Molex |
KIT CONN MULTI WIRE-BOARD 240PC |
1 |
|
KitsConnector Kits are modular hardware assemblies designed to establish reliable electrical or optical connections between components in electronic systems. Defined by standardized interfaces and configurable modules, these kits enable rapid deployment of connectivity solutions across diverse industries. Their importance stems from enabling seamless data transfer, power distribution, and signal integrity in modern automation, telecommunications, and industrial equipment.
| Type | Functional Features | Application Examples |
|---|---|---|
| Industrial Circular Connectors | Multi-pin configurations, IP67+ protection, vibration resistance | Factory automation equipment, robotics |
| Rectangular PCB Connectors | High-density signal transmission, 0.8-5.0mm pitch options | Control cabinets, test equipment |
| Fiber Optic Adapters | LC/SC/MPO interfaces, <0.2dB insertion loss | Data centers, 5G base stations |
| RF Coaxial Connectors | 50/75 impedance, 0-18GHz frequency range | Wireless communication systems |
| Power Distribution Blocks | 10-200A current capacity, fuse integration options | Machinery, renewable energy systems |
Typical kits contain: - Contact elements (phosphor bronze/copper alloy with Au/Ni plating) - Insulating housing (UL94 V-0 rated thermoplastics) - Mechanical actuation components (latches, alignment guides) - Sealing elements (EPDM rubber gaskets) - Cable termination interfaces (screw terminals, insulation displacement)
| Parameter | Typical Range | Significance |
|---|---|---|
| Current Rating | 0.5-200A | Determines power transmission capacity |
| Contact Resistance | 1-20m | Impacts signal integrity and heating |
| Dielectric Strength | 500V-5kV | Ensures electrical safety |
| Operating Temperature | -55 C to +125 C | Defines environmental tolerance |
| IP Rating | IP20 to IP69K | Indicates protection against foreign objects |
| Insertion Force | 0.5-10N | Affects usability and durability |
Primary industries include: - Industrial Automation (PLC systems, servo drives) - Telecommunications (5G NR remote radio heads) - Automotive (EV charging stations, ADAS sensors) - Medical Equipment (MRI scanners, patient monitoring) - Renewable Energy (solar inverters, wind turbine controllers)
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TE Connectivity | DEUTSCH DRC Series | 8-37 way configurations, aerospace qualified |
| Amphenol | SIN A-MAX | Multi-gigabit data rates, EMI shielding |
| Molex | PicoBlade 0.8mm | Space-saving board-to-wire solutions |
| Delphi | CompactTTC | Thermal management for high-power EV charging |
Key considerations: - Electrical requirements (current, voltage, frequency) - Environmental conditions (temperature, humidity, vibration) - Mechanical constraints (space limitations, mating cycles) - Compliance standards (RoHS, REACH, UL certification) - Cost/performance balance (modular vs custom designs)
Emerging developments include: - Miniaturization (sub-1mm pitch connectors) - High-speed transmission (56Gbps+ differential pairs) - Smart connectors with integrated sensors - Increased adoption of hybrid optical-electrical interfaces - Growth in automotive-specific modular kits for autonomous vehicles - Sustainability focus (bio-based polymers, recyclable designs)