| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
KIT MINI-FIT SR WTW WTB 10MM |
0 |
|
 |
Woodhead - Molex |
KIT CONN MV-396 ASSORTED WTB |
0 |
|
 |
Woodhead - Molex |
KIT CONN MULTI WIRE-BOARD 448PC |
0 |
|
 |
Woodhead - Molex |
KIT CONN & CORD NANO-CHANGE |
0 |
|
 |
Woodhead - Molex |
KIT CONN IPASS SERIES |
0 |
|
 |
Woodhead - Molex |
KIT CONN MX-150 |
0 |
|
 |
Woodhead - Molex |
KIT CONN MULTI WIRE-BOARD 499PC |
0 |
|
 |
Woodhead - Molex |
KIT CONN MINI-FIT SR. SERIES |
0 |
|
 |
Woodhead - Molex |
KIT CONN STD .062" 5 CIRCUITS |
0 |
|
 |
Woodhead - Molex |
KIT PICOBLADE 1.25MM RA HDR |
0 |
|
 |
Woodhead - Molex |
KIT CONN STD .093" 5 CIRCUITS |
0 |
|
 |
Woodhead - Molex |
KIT CONN PICO-SPOX SERIES |
0 |
|
 |
Woodhead - Molex |
KIT CONN PERMA-SEAL SERIES |
0 |
|
 |
Woodhead - Molex |
KIT CONN BEAU EUROSTYLE 10MM |
0 |
|
 |
Woodhead - Molex |
KIT CONN MICRO-LATCH ASSORTED |
0 |
|
 |
Woodhead - Molex |
KIT PICOBLADE WTB ALL INCLUSIVE |
0 |
|
 |
Woodhead - Molex |
KIT QUICK DISCONNECT K-173 |
0 |
|
 |
Woodhead - Molex |
KIT CONN & CORD MICRO-CHANGE |
0 |
|
 |
Woodhead - Molex |
KIT CONN FFC/FPC SERIES |
0 |
|
 |
Woodhead - Molex |
KIT CONN STD .062" 15 CIRCUITS |
0 |
|
KitsConnector Kits are modular hardware assemblies designed to establish reliable electrical or optical connections between components in electronic systems. Defined by standardized interfaces and configurable modules, these kits enable rapid deployment of connectivity solutions across diverse industries. Their importance stems from enabling seamless data transfer, power distribution, and signal integrity in modern automation, telecommunications, and industrial equipment.
| Type | Functional Features | Application Examples |
|---|---|---|
| Industrial Circular Connectors | Multi-pin configurations, IP67+ protection, vibration resistance | Factory automation equipment, robotics |
| Rectangular PCB Connectors | High-density signal transmission, 0.8-5.0mm pitch options | Control cabinets, test equipment |
| Fiber Optic Adapters | LC/SC/MPO interfaces, <0.2dB insertion loss | Data centers, 5G base stations |
| RF Coaxial Connectors | 50/75 impedance, 0-18GHz frequency range | Wireless communication systems |
| Power Distribution Blocks | 10-200A current capacity, fuse integration options | Machinery, renewable energy systems |
Typical kits contain: - Contact elements (phosphor bronze/copper alloy with Au/Ni plating) - Insulating housing (UL94 V-0 rated thermoplastics) - Mechanical actuation components (latches, alignment guides) - Sealing elements (EPDM rubber gaskets) - Cable termination interfaces (screw terminals, insulation displacement)
| Parameter | Typical Range | Significance |
|---|---|---|
| Current Rating | 0.5-200A | Determines power transmission capacity |
| Contact Resistance | 1-20m | Impacts signal integrity and heating |
| Dielectric Strength | 500V-5kV | Ensures electrical safety |
| Operating Temperature | -55 C to +125 C | Defines environmental tolerance |
| IP Rating | IP20 to IP69K | Indicates protection against foreign objects |
| Insertion Force | 0.5-10N | Affects usability and durability |
Primary industries include: - Industrial Automation (PLC systems, servo drives) - Telecommunications (5G NR remote radio heads) - Automotive (EV charging stations, ADAS sensors) - Medical Equipment (MRI scanners, patient monitoring) - Renewable Energy (solar inverters, wind turbine controllers)
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TE Connectivity | DEUTSCH DRC Series | 8-37 way configurations, aerospace qualified |
| Amphenol | SIN A-MAX | Multi-gigabit data rates, EMI shielding |
| Molex | PicoBlade 0.8mm | Space-saving board-to-wire solutions |
| Delphi | CompactTTC | Thermal management for high-power EV charging |
Key considerations: - Electrical requirements (current, voltage, frequency) - Environmental conditions (temperature, humidity, vibration) - Mechanical constraints (space limitations, mating cycles) - Compliance standards (RoHS, REACH, UL certification) - Cost/performance balance (modular vs custom designs)
Emerging developments include: - Miniaturization (sub-1mm pitch connectors) - High-speed transmission (56Gbps+ differential pairs) - Smart connectors with integrated sensors - Increased adoption of hybrid optical-electrical interfaces - Growth in automotive-specific modular kits for autonomous vehicles - Sustainability focus (bio-based polymers, recyclable designs)