ample-chip ample-chip
RFQ
BOM

Specialized ICs

Image Part Number Description / PDF Quantity Rfq
PSMN041-80YL115

PSMN041-80YL115

NXP Semiconductors

NOW NEXPERIA 25A, 80V, 0.041OHM,

0
74LVC3G06GT115

74LVC3G06GT115

NXP Semiconductors

NOW NEXPERIA 74LVC3G06GT INVERTE

69980
BZX79-B6V2143

BZX79-B6V2143

NXP Semiconductors

NOW NEXPERIA BZX79-B6V2 - ZENER

105000
MC34VR5100A2EP557

MC34VR5100A2EP557

NXP Semiconductors

MULTI-OUTPUT DC/DC REGULATOR FOR

1040
MKL24Z64VLH4557

MKL24Z64VLH4557

NXP Semiconductors

KINETIS KL24: 48MHZ CORTEX-M0+ U

0
BZX384-C11

BZX384-C11

NXP Semiconductors

BZX384 SERIES - VOLTAGE REGULATO

0
SC16C550BIBS128

SC16C550BIBS128

NXP Semiconductors

SERIAL I/O CONTROLLER 1 CHANNEL

6000
74LVC2G17GM132

74LVC2G17GM132

NXP Semiconductors

NOW NEXPERIA 74LVC2G17GM - BUFFE

4608
MC9S08AW60CFUE557

MC9S08AW60CFUE557

NXP Semiconductors

MICROCONTROLLER, 8-BIT, HC08/S08

0
PTN36221AHX147

PTN36221AHX147

NXP Semiconductors

SINGLE-CHANNEL SUPERSPEED USB 3.

10000
PTN3355BS/F1528

PTN3355BS/F1528

NXP Semiconductors

LOW POWER DISPLAYPORT TO VGA ADA

15490
PTVS17VS1UTR115

PTVS17VS1UTR115

NXP Semiconductors

NOW NEXPERIA PTVS17VS1UTR TRANS

12000
PCA8534AH/Q900/1518

PCA8534AH/Q900/1518

NXP Semiconductors

AUTOMOTIVE LCD DRIVER FOR LOW MU

0
BGX7100HN1118

BGX7100HN1118

NXP Semiconductors

BGX7100 - TRANSMITTER IQ MODULAT

0
PHB66NQ03LT118

PHB66NQ03LT118

NXP Semiconductors

NOW NEXPERIA PHB66NQ03LT 66A, 25

800
BAS416135

BAS416135

NXP Semiconductors

BAS416 - RECTIFIER DIODE, 0.2A,

0
PCF7922ATT/D1AE0700,118

PCF7922ATT/D1AE0700,118

NXP Semiconductors

PCF7922ATT/D1AE0700118

2500
PXT4403115

PXT4403115

NXP Semiconductors

NOW NEXPERIA SMALL SIGNAL BIPOLA

0
BGU8009115

BGU8009115

NXP Semiconductors

IC AMP MMIC LNA 6XSON

0
PZU6.2B3115

PZU6.2B3115

NXP Semiconductors

NOW NEXPERIA PZU6.2B3 ZENER DIOD

52450

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
RFQ BOM Call Skype Email
Top