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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
MK10DN64VLF5557

MK10DN64VLF5557

NXP Semiconductors

KINETIS K10: MICROCONTROLLER COR

100
74ABT162245ADL112

74ABT162245ADL112

NXP Semiconductors

NOW NEXPERIA 74ABT162245ADL - BU

1581
TFA9890AUK/N1062

TFA9890AUK/N1062

NXP Semiconductors

9.5V BOOSTED AUDIO SYSTEM

1080000
74LVT14DB118

74LVT14DB118

NXP Semiconductors

NOW NEXPERIA 74LVT14DB - INVERTE

2000
74LVC1G175GW

74LVC1G175GW

NXP Semiconductors

D FLIP-FLOP, LVC/LCX/Z SERIES, 1

0
CBTL04083BBS

CBTL04083BBS

NXP Semiconductors

IC MUX/DEMUX 2:1 4CH 42HVQFN

8000
PZU4.7BL315

PZU4.7BL315

NXP Semiconductors

NOW NEXPERIA PZU4.7BL ZENER DIOD

7240
PDTC115TMB315

PDTC115TMB315

NXP Semiconductors

NOW NEXPERIA PDTC115TMB - SMALL

129950
TYN16X-600CT127

TYN16X-600CT127

NXP Semiconductors

NOW WEEN - TYN16X-600CT - SILICO

283000
74AHC164D112

74AHC164D112

NXP Semiconductors

NOW NEXPERIA 74AHC164D - SERIAL

0
PTVS48VP1UP115

PTVS48VP1UP115

NXP Semiconductors

NOW NEXPERIA PTVS48VP1UP TRANS V

99000
MC33879APEK574

MC33879APEK574

NXP Semiconductors

SWITCH, CONGIFURABLE 8 CHANNELS,

0
S9S12GN32F0VLF557

S9S12GN32F0VLF557

NXP Semiconductors

MICROCONTROLLER, 16-BIT, HCS12 C

0
TDA18250AHN/C1518

TDA18250AHN/C1518

NXP Semiconductors

IC TUNER CABLE/STB 32HVQFN

4654
BAS116L315

BAS116L315

NXP Semiconductors

BAS116L - RECTIFIER DIODE

0
SPC5742PK1AMLQ5557

SPC5742PK1AMLQ5557

NXP Semiconductors

MPC574XP MICROCONTROLLER POWER A

750
PBSS2515M315

PBSS2515M315

NXP Semiconductors

NOW NEXPERIA PBSS2515M - SMALL S

8108
UJA1061TW/5V0/C/T518

UJA1061TW/5V0/C/T518

NXP Semiconductors

FAULT-TOLERANT CAN/LIN FAIL-SAFE

10000
S9S12G48F1VLCR528

S9S12G48F1VLCR528

NXP Semiconductors

16-BIT MCU, S12 CORE, 48KB FLASH

0
MK22FX512AVMD12557

MK22FX512AVMD12557

NXP Semiconductors

KINETIS K22: 120MHZ CORTEX-M4F M

800

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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