PMIC - Power Distribution Switches, Load Drivers

Part Number	Description / PDF	Quantity
MIC4126YML	DUAL 1.5A-PEAK LOW-SIDE MOSFET D	2991
TPS22968QDMGRQ1 Texas Instruments	IC PWR SWITCH N-CHAN 1:1 10WSON	0
TPS2236DAPR Texas Instruments	POWER SUPPLY CIRCUIT, FIXED	8000
MIC59P50BV Roving Networks / Microchip Technology	8-BIT PARALLEL-IN LATCHED DRIVER	2324
MP62131ES-LF-Z MPS (Monolithic Power Systems)	IC PWR SWITCH 1:1 8SOIC	0
UCS2114T-1-V/LX Roving Networks / Microchip Technology	IC PWR SWITCH 1:1 20VQFN	3618
BD2065AFJ-E2 ROHM Semiconductor	IC SWITCH USB HI SIDE 1CH SOP-J8	4503
MAX4821ETP+ Maxim Integrated	IC PWR DRIVER N-CHAN 1:8 20TQFN	8861500
MIC94064YC6-TR Roving Networks / Microchip Technology	IC PWR SWITCH P-CHAN 1:1 SC70-6	2543
TPS2226ADBG4 Texas Instruments	IC PWR SWITCH 3:4 30SSOP	0
TDE1707BFPT STMicroelectronics	IC PWR SWITCH BIPOLAR 1:2 8SO	0
MAX14913AKN+T Maxim Integrated	IC PWR DRIVER 1:8 56QFN	2500
VN5160S-E STMicroelectronics	IC PWR DRIVER N-CHANNEL 1:1 8SO	0
MIC94072YMT	HIGH SIDE POWER SWITCHES	22109
NCP45560IMNTWG-H Sanyo Semiconductor/ON Semiconductor	IC PWR SWITCH N-CHAN 1:1 12DFN	368
MP62181DH-LF-P MPS (Monolithic Power Systems)	IC PWR SWITCH 1:1 8MSOP	0
NCP382LD15AAR2G Sanyo Semiconductor/ON Semiconductor	IC PWR SWITCH P-CHAN 1:2 8SOIC	4682
AP2186MPG-13 Zetex Semiconductors (Diodes Inc.)	IC PWR SWITCH P-CHAN 1:2 8MSOP	1515
TPS2231PWRG4 Texas Instruments	IC PWR SWITCH 1:1 20TSSOP	0
MC33882PVW NXP Semiconductors	IC PWR SWITCH N-CHAN 1:1 30HSOP	0

PMIC - Power Distribution Switches, Load Drivers

1. Overview

Power Management Integrated Circuits (PMICs) featuring Power Distribution Switches and Load Drivers are critical components in modern electronic systems. These devices manage power routing, load control, and protection functions in applications ranging from portable devices to industrial equipment. Power Distribution Switches handle voltage/current path selection, while Load Drivers provide controlled driving capability for high-current loads. Their integration improves system efficiency, reduces component count, and enhances reliability.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Load Switches	Low R_DS(on), fast turn-on/off, inrush current control	Smartphones, laptops, servers
Distribution Switches	Multi-channel power path management, fault isolation	Automotive systems, industrial PLCs
Smart Load Drivers	Integrated FETs + protection logic, current sensing	Robotics, motor controls, LED lighting
Hot Swap Controllers	Controlled startup, overcurrent/voltage protection	Data center servers, telecom equipment

3. Structure & Composition

Typical components include:

Power MOSFETs (usually NMOS/PMOS) with low on-resistance
Gate drivers and control logic circuits
Protection modules (OCP, OVP, OTP, UVLO)
Current sensing elements (shunt resistors or amplifiers)
Thermal management structures (heat spreaders, thermal vias)

Common packaging: QFN, TSSOP, BGA with exposed thermal pads

4. Key Technical Specifications

Parameter	Description	Importance
R_DS(on)	On-state resistance (1-50 m range)	Directly affects conduction loss
I_MAX	Maximum continuous current (0.5-10A typical)	Determines load capacity
V_SUPPLY	Operating voltage range (2.7-40V typical)	System compatibility factor
t_ON/OFF	Switching transition time (1-100 s)	Affects EMI and power efficiency
Quiescent Current	Standby power consumption ( A range)	Battery life consideration

5. Application Fields

Consumer Electronics: Smartphones (display/backlight drivers), notebooks (peripheral power control)
Automotive: Electric vehicle power distribution, ADAS sensor power management
Industrial: PLCs, motor drives, test equipment
Telecom/Datacom: Server power rails, PoE systems, base stations
Medical: Portable diagnostic devices, imaging equipment

6. Leading Manufacturers & Products

Manufacturer	Product Series	Key Features
Texas Instruments	TPS229xx family	18m R_DS(on), 6A rating, load current monitoring
STMicroelectronics	VN7000 series	Smart high-side switches, automotive qualified
Infineon	BTS7xx series	Integrated diagnostics, 24V operation
ON Semiconductor	NCP380 series	40V tolerant, fast overcurrent protection

7. Selection Recommendations

Key consideration factors:

Current/voltage requirements with safety margins (>20% over spec)
Thermal performance: Junction-to-ambient thermal resistance
Protection features matching application environment
Control interface compatibility (GPIO, I2C, PWM)
Package size vs. board space constraints

Case Study: For a 12V/3A motor driver in an industrial robot, select a device with:

R_DS(on) < 30m to limit loss to <0.27W
Operating temperature range -40 C to 125 C
Integrated current sensing for feedback control

8. Industry Trends

Integration of GaN/SiC FETs for higher efficiency (2024-2030)
Development of bidirectional switches for energy recovery systems
Increasing adoption of digital control interfaces (PMBus compliance)
Tighter functional safety compliance (ISO 26262 for automotive)
Advanced thermal packaging (double-sided cooling, copper pillar technology)