PMIC - Laser Drivers

Image Part Number Description / PDF Quantity Rfq
MAX3996CTP+

MAX3996CTP+

Maxim Integrated

IC LASER DRVR 2.5GB 5.5V 20TQFN

140

MAX3949ETE+

MAX3949ETE+

Maxim Integrated

IC LASER DRV 11.3GB 3.63V 16TQFN

0

MAX3643ETG+

MAX3643ETG+

Maxim Integrated

IC LASER DRVR 2.5GB 3.6V 24TQFN

82250

DS1864T+T&R

DS1864T+T&R

Maxim Integrated

IC LASER CTRLR 5.5V 28TQFN

0

MAX3738ETG+T

MAX3738ETG+T

Maxim Integrated

IC LASER DRV 4.25GB 3.63V 24TQFN

3251

MAX3736ETE+T

MAX3736ETE+T

Maxim Integrated

IC LASER DRVR 3.2GB 3.63V 16TQFN

0

MAX3643ETG+T

MAX3643ETG+T

Maxim Integrated

IC LASER DRVR 2.5GB 3.6V 24TQFN

2172

MAX3735AETG+

MAX3735AETG+

Maxim Integrated

IC LASER DRVR 2.7GB 3.63V 24TQFN

1343225

MAX3949ETE+T

MAX3949ETE+T

Maxim Integrated

IC LASER DRV 11.3GB 3.63V 16TQFN

0

MAX3656ETG+

MAX3656ETG+

Maxim Integrated

IC LASER DRVR 2.5GB 3.6V 24TQFN

2898750

MAX3646ETG+

MAX3646ETG+

Maxim Integrated

IC LASER DR 622MBPS 3.63V 24TQFN

1741875

PHY1090-DS-WR

PHY1090-DS-WR

Maxim Integrated

IC OPAMP

0

MAX3727CTE+T

MAX3727CTE+T

Maxim Integrated

IC LASER DIODE DRIVER QFN

0

MAX3727CTE+

MAX3727CTE+

Maxim Integrated

IC LASER DIODE DRIVER QFN

3002625

MAX3728ACTE+

MAX3728ACTE+

Maxim Integrated

IC LASER DIODE DRIVER QFN

0

MAX3728ACTE+T

MAX3728ACTE+T

Maxim Integrated

IC LASER DIODE DRIVER QFN

0

DS1862B+T&R

DS1862B+T&R

Maxim Integrated

IC LASER CTRLR 10GBPS 5.5V 25BGA

0

MAX3996CTP+T

MAX3996CTP+T

Maxim Integrated

IC LASER DRVR 2.5GB 5.5V 20TQFN

0

DS1861E+

DS1861E+

Maxim Integrated

IC LASER CTRLR 5.5V 14TSSOP

0

DS1874T+T&R

DS1874T+T&R

Maxim Integrated

IC LASER CTRLR 3.9V 28TQFN

0

PMIC - Laser Drivers

1. Overview

Laser drivers in Power Management Integrated Circuits (PMICs) are specialized electronic components designed to control and power laser diodes. They regulate current flow to maintain stable laser output, enable precise modulation, and protect against electrical faults. These drivers are critical in applications requiring high-speed optical signal transmission, precision sensing, and industrial processing.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Continuous-Wave (CW) DriversProvide constant current for steady-state laser operationFiber optic communication systems
Pulsed Laser DriversGenerate high-current pulses for pulsed laser operationLIDAR systems, laser rangefinders
Modulating DriversSupport analog/digital modulation up to GHz frequenciesHigh-speed data transmission
Tunable DriversAllow wavelength adjustment through current/temperature controlSpectroscopy equipment

3. Structure and Components

Typical laser driver architecture includes: - Input power conditioning circuitry - Precision current source with <0.1% regulation - High-speed modulation path (up to 25 Gbps) - Thermal protection and overcurrent detection - Laser diode interface with EMI shielding Advanced packages integrate digital control interfaces (I2C, SPI) and diagnostic feedback systems.

4. Key Technical Specifications

ParameterImportanceTypical Range
Output Current RangeDetermines laser power level10mA - 2.5A
Modulation BandwidthDefines data transmission speedDC - 28 GHz
Current Noise DensityAffects optical signal purity<5 nA/ Hz
Thermal Shutdown ThresholdProtects laser diode integrity125 C - 150 C
Power EfficiencyImpacts system thermal management75% - 92%

5. Application Areas

  • Telecommunications: 100G/400G optical transceivers
  • Medical: Laser surgical equipment, diagnostic imaging
  • Industrial: Laser marking/cutting machines
  • Consumer: 3D sensing in smartphones
  • Automotive: ADAS LIDAR systems

6. Major Manufacturers and Products

ManufacturerProduct SeriesKey Features
Analog DevicesADN284x25 Gbps modulation, integrated TEC control
Texas InstrumentsLMT844-channel driver for LiDAR, 3.5A peak current
STMicroelectronicsLD55xxDigital diagnostic interface, 1.2A output
InfineonIRS2975Automotive grade, 200MHz bandwidth

7. Selection Guidelines

Key consideration factors: - Match output current capabilities with laser diode specifications - Verify modulation bandwidth compatibility with system requirements - Evaluate thermal protection features for reliability - Assess integration level (discrete vs. system-on-chip) - Consider package type (QFN, BGA) for PCB design

8. Industry Trends

Emerging developments include: - Integration with optical feedback loops for closed-loop power control - Development of GaN-based drivers for higher switching frequencies - Implementation of digital telemetry for predictive maintenance - Miniaturization for wearable laser-based sensors - Increased focus on automotive-grade drivers for autonomous vehicles

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