PMIC - Laser Drivers

Image Part Number Description / PDF Quantity Rfq
MAX3799ETJ+

MAX3799ETJ+

Maxim Integrated

IC LASER DRVR 14GB 3.63V 32TQFN

561980

MAX3738ETG+

MAX3738ETG+

Maxim Integrated

IC LASER DRV 4.25GB 3.63V 24TQFN

148

MAX3869EHJ+

MAX3869EHJ+

Maxim Integrated

IC LASER DRVR 2.5GB 5.5V 32TQFP

2771800

PHY1078-01QT-RR

PHY1078-01QT-RR

Maxim Integrated

2.5G BM LASER GEPON TXRX

0

MAX3737ETJ+

MAX3737ETJ+

Maxim Integrated

IC LASER DRVR 2.7GB 3.63V 32TQFN

57

MAX3646ETG+T

MAX3646ETG+T

Maxim Integrated

IC LASER DR 622MBPS 3.63V 24TQFN

0

MAX3967AETG+T

MAX3967AETG+T

Maxim Integrated

IC LASER DRV 270MBPS 5.5V 24TQFN

2223

MAX3740AETG+T

MAX3740AETG+T

Maxim Integrated

IC LASER DRVR 3.2GB 3.63V 24TQFN

650

MAX3740AETG+

MAX3740AETG+

Maxim Integrated

IC LASER DRVR 3.2GB 3.63V 24TQFN

1400

MAX3799ETJ+T

MAX3799ETJ+T

Maxim Integrated

IC LASER DRVR 14GB 3.63V 32TQFN

2245

MAX3735AETG+T

MAX3735AETG+T

Maxim Integrated

IC LASER DRVR 2.7GB 3.63V 24TQFN

105

PHY2078QT-RR

PHY2078QT-RR

Maxim Integrated

2.5G BM LASER PON TXRX

0

MAX3946ETG+T

MAX3946ETG+T

Maxim Integrated

IC LASER DRV 11.3GB 3.63V 24TQFN

0

MAX3967AETG+

MAX3967AETG+

Maxim Integrated

IC LASER DRV 270MBPS 5.5V 24TQFN

3541350

DS1863E+T&R

DS1863E+T&R

Maxim Integrated

IC LASER CTRLR 5.5V 16TSSOP

0

MAX3948ETE+

MAX3948ETE+

Maxim Integrated

IC LASER DRV 11.3GB 3.63V 16TQFN

200

MAX3656ETG+T

MAX3656ETG+T

Maxim Integrated

IC LASER DRVR 2.5GB 3.6V 24TQFN

9427

MAX3736ETE+

MAX3736ETE+

Maxim Integrated

IC LASER DRVR 3.2GB 3.63V 16TQFN

12341300

MAX3795ETG+

MAX3795ETG+

Maxim Integrated

IC LASER DRV 4.25GB 3.63V 24TQFN

963

MAX3946ETG+

MAX3946ETG+

Maxim Integrated

IC LASER DRV 11.3GB 3.63V 24TQFN

149

PMIC - Laser Drivers

1. Overview

Laser drivers in Power Management Integrated Circuits (PMICs) are specialized electronic components designed to control and power laser diodes. They regulate current flow to maintain stable laser output, enable precise modulation, and protect against electrical faults. These drivers are critical in applications requiring high-speed optical signal transmission, precision sensing, and industrial processing.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Continuous-Wave (CW) DriversProvide constant current for steady-state laser operationFiber optic communication systems
Pulsed Laser DriversGenerate high-current pulses for pulsed laser operationLIDAR systems, laser rangefinders
Modulating DriversSupport analog/digital modulation up to GHz frequenciesHigh-speed data transmission
Tunable DriversAllow wavelength adjustment through current/temperature controlSpectroscopy equipment

3. Structure and Components

Typical laser driver architecture includes: - Input power conditioning circuitry - Precision current source with <0.1% regulation - High-speed modulation path (up to 25 Gbps) - Thermal protection and overcurrent detection - Laser diode interface with EMI shielding Advanced packages integrate digital control interfaces (I2C, SPI) and diagnostic feedback systems.

4. Key Technical Specifications

ParameterImportanceTypical Range
Output Current RangeDetermines laser power level10mA - 2.5A
Modulation BandwidthDefines data transmission speedDC - 28 GHz
Current Noise DensityAffects optical signal purity<5 nA/ Hz
Thermal Shutdown ThresholdProtects laser diode integrity125 C - 150 C
Power EfficiencyImpacts system thermal management75% - 92%

5. Application Areas

  • Telecommunications: 100G/400G optical transceivers
  • Medical: Laser surgical equipment, diagnostic imaging
  • Industrial: Laser marking/cutting machines
  • Consumer: 3D sensing in smartphones
  • Automotive: ADAS LIDAR systems

6. Major Manufacturers and Products

ManufacturerProduct SeriesKey Features
Analog DevicesADN284x25 Gbps modulation, integrated TEC control
Texas InstrumentsLMT844-channel driver for LiDAR, 3.5A peak current
STMicroelectronicsLD55xxDigital diagnostic interface, 1.2A output
InfineonIRS2975Automotive grade, 200MHz bandwidth

7. Selection Guidelines

Key consideration factors: - Match output current capabilities with laser diode specifications - Verify modulation bandwidth compatibility with system requirements - Evaluate thermal protection features for reliability - Assess integration level (discrete vs. system-on-chip) - Consider package type (QFN, BGA) for PCB design

8. Industry Trends

Emerging developments include: - Integration with optical feedback loops for closed-loop power control - Development of GaN-based drivers for higher switching frequencies - Implementation of digital telemetry for predictive maintenance - Miniaturization for wearable laser-based sensors - Increased focus on automotive-grade drivers for autonomous vehicles

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