PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX4273EEE+

MAX4273EEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

1847

MAX4272ESA+T

MAX4272ESA+T

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

768

MAX5902LCEUT+T

MAX5902LCEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

395

MAX5903ABEUT+T

MAX5903ABEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

0

MAX5924DEUB+

MAX5924DEUB+

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

1832850

MAX5947CESA+

MAX5947CESA+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

100300

MAX5925DEUB+

MAX5925DEUB+

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

221800

MAX8533EUB+T

MAX8533EUB+T

Maxim Integrated

IC HOTSWAP CTR INFINIBAND 10UMAX

0

MAX5903LBEUT+T

MAX5903LBEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

1178

MAX5932ESA+T

MAX5932ESA+T

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

0

MAX5901ACEUT+T

MAX5901ACEUT+T

Maxim Integrated

IC HOT SWAP CTRLR -48V SOT23-6

0

MAX4271ESA+

MAX4271ESA+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

285

MAX15095AGFC+

MAX15095AGFC+

Maxim Integrated

6A HOTSWAP

400

MAX15090CEWI+T

MAX15090CEWI+T

Maxim Integrated

IC HOT SWAP CTRLR GP 28WLP

0

MAX15095DGFC+T

MAX15095DGFC+T

Maxim Integrated

6A HOT SWAP

0

MAX15162AWE+T

MAX15162AWE+T

Maxim Integrated

60V DUAL EFUSE FOR PA

12500

MAX15095GFC+T

MAX15095GFC+T

Maxim Integrated

6A HOTSWAP

2500

MAX15095GFC+

MAX15095GFC+

Maxim Integrated

6A HOTSWAP

798

MAX15096AGWE+T

MAX15096AGWE+T

Maxim Integrated

IC HOT SWAP CONTROLLER 16WLP

0

MAX15095DGFC+

MAX15095DGFC+

Maxim Integrated

6A HOTSWAP

1000

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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