PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5900LBETT+T

MAX5900LBETT+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 6TDFN

1000

MAX5908UEE+

MAX5908UEE+

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 16QSOP

1000

MAX5933EESA+

MAX5933EESA+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

1100

MAX5900ACETT+T

MAX5900ACETT+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 6TDFN

0

MAX5921AESA+T

MAX5921AESA+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

12500

MAX5921FESA+T

MAX5921FESA+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

0

MAX5977AETP+

MAX5977AETP+

Maxim Integrated

IC HOT SWAP CTRLR GP 20TQFN

7

MAX5921EESA+

MAX5921EESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

1003300

MAX15093GWL+T

MAX15093GWL+T

Maxim Integrated

15A EFUSE WITH INTEGRATED FET

0

MAX5917BESE+

MAX5917BESE+

Maxim Integrated

IC HOT SWAP CTR NETWORKNG 16SOIC

131

MAX5955AUEE+T

MAX5955AUEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

MAX5976AETE+

MAX5976AETE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16TQFN

313900

MAX5921AESA+

MAX5921AESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

2356700

DS4560S-LO+

DS4560S-LO+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

85

MAX5902NNEUT+T

MAX5902NNEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

2500

MAX5956AEEE+T

MAX5956AEEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

7500

MAX5920AESA+

MAX5920AESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

60

DS4560S-AR+T

DS4560S-AR+T

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

0

MAX15162ATG+T

MAX15162ATG+T

Maxim Integrated

60V DUAL EFUSE FOR PA

0

MAX4273ESE+

MAX4273ESE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16SOIC

231500

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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