PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4231HUD-1#PBF

LTC4231HUD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

611

LTC4241IGN#TRPBF

LTC4241IGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 20SSOP

0

LTC4252-2CMS8#TRPBF

LTC4252-2CMS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8MSOP

0

LTC4227IGN-1#PBF

LTC4227IGN-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

44

LTC4214-2IMS#TRPBF

LTC4214-2IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

LTC4238HGN#PBF

LTC4238HGN#PBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

0

ADM1278-2ACPZ-RL

ADM1278-2ACPZ-RL

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32LFCSP

4997

MAX5916AEUI+

MAX5916AEUI+

Analog Devices, Inc.

POWER SUPPLY SUPPORT CIRCUIT, AD

301

LTC1422CN8#PBF

LTC1422CN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8DIP

0

LTC4350CGN#PBF

LTC4350CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

110

LTC4281CUFD#PBF

LTC4281CUFD#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

LT1641-2IS8#TRPBF

LT1641-2IS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

1758

LTC4216CDE#TRPBF

LTC4216CDE#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12DFN

0

MAX5901LBEUT

MAX5901LBEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

2291

LTC1644IGN#PBF

LTC1644IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 20SSOP

134

LTC1421CSW#PBF

LTC1421CSW#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

2

MAX5939EESA

MAX5939EESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

500

LTC4350IGN#TRPBF

LTC4350IGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

0

LTC4252CCMS-2#TRPBF

LTC4252CCMS-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

LTC4227IUFD-1#PBF

LTC4227IUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

87

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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