PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4260ISW#PBF

LTC4260ISW#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

63

ADM1075-1ARUZ-RL7

ADM1075-1ARUZ-RL7

Analog Devices, Inc.

MINUS 48V HOT SWAP CONTROLLER AN

1000

LTC4242CUHF#TRPBF

LTC4242CUHF#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI EXP 38QFN

0

LTC4224IMS-2#TRPBF

LTC4224IMS-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

LTC4215CGN#PBF

LTC4215CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

0

LTC1421CG-2.5#TRPBF

LTC1421CG-2.5#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

LTC4211CS8#PBF

LTC4211CS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

251

LTC4216IDE#PBF

LTC4216IDE#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12DFN

84

LT4250HIS8#PBF

LT4250HIS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

102

LTC4211IMS#TRPBF

LTC4211IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

1943

LTC4261IGN#PBF

LTC4261IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28SSOP

11

LTC4240IGN#PBF

LTC4240IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 28SSOP

0

MAX5903ACETT-T

MAX5903ACETT-T

Analog Devices, Inc.

HOT-SWAP CONTROLLER

2944

LTC4238IGN#PBF

LTC4238IGN#PBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

30

LTC4217CFE#PBF

LTC4217CFE#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20TSSOP

240

LT4250LIN8#PBF

LT4250LIN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

0

LTC4229CG#TRPBF

LTC4229CG#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

MAX5907UEE

MAX5907UEE

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

930

MAX5900AAEUT-T

MAX5900AAEUT-T

Analog Devices, Inc.

HOT-SWAP CONTROLLER

2500

LTC4228CGN-2#PBF

LTC4228CGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28SSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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