PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4261CGN-2#PBF

LTC4261CGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28SSOP

0

LTC4245CUHF#PBF

LTC4245CUHF#PBF

Analog Devices, Inc.

MULTIPLE SUPPLY HOT SWAP CONTROL

27

LTC4227CGN-1#PBF

LTC4227CGN-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

7

LT1640HIN8#PBF

LT1640HIN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

0

MAX5948AESA

MAX5948AESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

1680

LT4254CGN#PBF

LT4254CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

600

LTC4281IUFD#PBF

LTC4281IUFD#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

LTC4234CWHH#PBF

LTC4234CWHH#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

LTC1421CSW-2.5#TRPBF

LTC1421CSW-2.5#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

0

LTC4228CUFD-1#TRPBF

LTC4228CUFD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

MAX5903LCEUT

MAX5903LCEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

0

LTC1643AL-1CGN#PBF

LTC1643AL-1CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

250

MAX8533EUB+

MAX8533EUB+

Analog Devices, Inc.

MAX8533 SMALLEST, MOST RELIABLE,

6340

MAX5902LCETT+T

MAX5902LCETT+T

Analog Devices, Inc.

HOT-SWAP CONTROLLER

5000

LTC4216CMS#PBF

LTC4216CMS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

51

LTC4210-3IS6#TRMPBF

LTC4210-3IS6#TRMPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP TSOT23-6

361

LTC4215CUFD-2#PBF

LTC4215CUFD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

112

LTC4225IUFD-1#PBF

LTC4225IUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

146

ADM1172-1AUJZ-RL7

ADM1172-1AUJZ-RL7

Analog Devices, Inc.

2.7V TO 16.5V HOT SWAP CONTROLLE

13821

LTC4228CUFD-1#PBF

LTC4228CUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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