PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5901AAETT+T

MAX5901AAETT+T

Analog Devices, Inc.

MAX5901 -100V TDFN, SIMPLE SWAPP

4650

LTC4228IGN-2#TRPBF

LTC4228IGN-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28SSOP

0

LTC4227CUFD-3#TRPBF

LTC4227CUFD-3#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

LTC4244CGN#PBF

LTC4244CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 20SSOP

0

LT1641-1IS8#PBF

LT1641-1IS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

963

LTC4231IUD-1#TRPBF

LTC4231IUD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

0

LTC4231HUD-2#TRPBF

LTC4231HUD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

0

MAX5903ABEUT

MAX5903ABEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

3274

LTC4252-2IMS8#PBF

LTC4252-2IMS8#PBF

Analog Devices, Inc.

POWER SUPPLY SUPPORT CIRCUIT, AD

650

LTC4238HUFD#PBF

LTC4238HUFD#PBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

45

LTC4227IUFD-2#TRPBF

LTC4227IUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

LTC4231HUD-1#TRPBF

LTC4231HUD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

0

LTC4226IMS-1#PBF

LTC4226IMS-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16MSOP

272

ADM1275-1ACPZ-R7

ADM1275-1ACPZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20LFCSP

0

LT4250LCN8#PBF

LT4250LCN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

20

MAX5955AEEE

MAX5955AEEE

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

9094

MAX5903NNEUT

MAX5903NNEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

4182

LTC4212IMS#TRPBF

LTC4212IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

LT1640AHCS8#PBF

LT1640AHCS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

LTM9100HY#PBF

LTM9100HY#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 42BGA

31

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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