PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4226CMS-1#TRPBF

LTC4226CMS-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16MSOP

0

LTC4231IMS-1#PBF

LTC4231IMS-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

601

ISL6150IBZ

ISL6150IBZ

Renesas Electronics America

POWER SUPPLY SUPPORT CIRCUIT, AD

1336

MIC2590B-2YTQ

MIC2590B-2YTQ

Roving Networks / Microchip Technology

DUAL-SLOT PCI HOT PLUG CONTROLLE

6102

MAX5954AETX+

MAX5954AETX+

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 36TQFN

1261350

LTC4236CUFD-1#TRPBF

LTC4236CUFD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

MAX5955BEEE+T

MAX5955BEEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

LTC4223IGN-2#TRPBF

LTC4223IGN-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

0

MAX5909UEE

MAX5909UEE

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

4975

MAX4272ESA+

MAX4272ESA+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

299

MAX15093GWL+

MAX15093GWL+

Maxim Integrated

15A EFUSE WITH INTEGRATED FET

5503850

UCC3918N

UCC3918N

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

41

PI6ULS5V9511AUEX

PI6ULS5V9511AUEX

Zetex Semiconductors (Diodes Inc.)

IC HOT SWAP CTRLR 8MSOP

1266337500

LTC4218IGN#PBF

LTC4218IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

1884

LTC4217CDHC-12#TRPBF

LTC4217CDHC-12#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

0

MAX5932ESA

MAX5932ESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

0

ISL61862BCRZ

ISL61862BCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

ISL61853EIRZ-T

ISL61853EIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

ISL61853MCRZ-T

ISL61853MCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LT4220CGN#PBF

LT4220CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

101

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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