PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
ADM1278-1AACPZ

ADM1278-1AACPZ

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32LFCSP

51

ADM1073ARUZ-REEL7

ADM1073ARUZ-REEL7

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 14TSSOP

730

LTC4260CGN#TRPBF

LTC4260CGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

TPS2321ID

TPS2321ID

Texas Instruments

TPS2321 3-13V DUAL HOT-SWAP IC W

16142

TPS2330IDR

TPS2330IDR

Texas Instruments

IC HOT SWAP CTRLR GP 14SOIC

0

MAX34565ETB+

MAX34565ETB+

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 10TDFN

400

LTC4253BCGN#PBF

LTC4253BCGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 16SSOP

95

LT1640HIS8#TRPBF

LT1640HIS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

TPS24750RUVR

TPS24750RUVR

Texas Instruments

12A EFUSE CIRCUIT PROTECTOR WITH

1986

ISL61852IIRZ

ISL61852IIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LTC4252CIMS-2#PBF

LTC4252CIMS-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

450

LM5068MM-1/NOPB

LM5068MM-1/NOPB

Texas Instruments

POWER SUPPLY CIRCUIT, FIXED

0

MAX5949AESA+T

MAX5949AESA+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

0

MAX15093AGWL+T

MAX15093AGWL+T

Maxim Integrated

15A EFUSE WITH INTEGRATED FET AN

2500

TPS2393APW

TPS2393APW

Texas Instruments

TPS2393A -48V HOT SWAP WITH INSE

6012

ISL6115AIBZ-T

ISL6115AIBZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR GP 8SOIC

0

TPS24713DGS

TPS24713DGS

Texas Instruments

TPS24713 2.5V TO 18V HIGH EFFIC

1840

TPS2310IPW

TPS2310IPW

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

34

UC2914N

UC2914N

POWER SUPPLY CIRCUIT, ADJ

7564

LTC4217IFE#TRPBF

LTC4217IFE#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20TSSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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