PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5956AEEE+

MAX5956AEEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

70

LTC4252CIMS-2#TRPBF

LTC4252CIMS-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

UCC3921DTR

UCC3921DTR

Texas Instruments

UCC3921 LATCHABLE NEGATIVE FLOAT

22500

UCC2918DP

UCC2918DP

POWER SUPPLY SUPPORT CIRCUIT, FI

2094

LM5069MMX-1/NOPB

LM5069MMX-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

2396

LT1640HCS8#TRPBF

LT1640HCS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

LTC4234HWHH#TRPBF

LTC4234HWHH#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

LTC4251-2IS6#TRPBF

LTC4251-2IS6#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V SOT23-6

0

LTC4216CMS#TRPBF

LTC4216CMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

LTC4231HUD-2#PBF

LTC4231HUD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

72

MAX5924AEUB

MAX5924AEUB

Analog Devices, Inc.

HOT-SWAP CONTROLLER

4334

LT1640ALIS8#PBF

LT1640ALIS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

68

LTC1643ALIGN#PBF

LTC1643ALIGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

92

UCC3912PWPG4

UCC3912PWPG4

Texas Instruments

IC HOT SWAP CTRLR GP 24HTSSOP

0

LTC4224IMS-1#TRPBF

LTC4224IMS-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

ISL61852JIRZ

ISL61852JIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LTC4252BIMS8-1#PBF

LTC4252BIMS8-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8MSOP

44

LT4256-3CGN#PBF

LT4256-3CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

71

ISL61853LIRZ

ISL61853LIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4242CG#PBF

LTC4242CG#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI EXP 36SSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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