PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
ISL61853CCRZ

ISL61853CCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC1646CGN#PBF

LTC1646CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

95

LTC1643AL-1CGN#TRPBF

LTC1643AL-1CGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

0

LM25069PMM-1/NOPB

LM25069PMM-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

1020

LTC4236CUFD-2#TRPBF

LTC4236CUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

LTC4253BIGN#PBF

LTC4253BIGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 16SSOP

118

TPS24751RUVT

TPS24751RUVT

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

0

ISL6116CBZA-T

ISL6116CBZA-T

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

25000

MAX5946AETX

MAX5946AETX

Analog Devices, Inc.

PCI EXPRESS HOT-PLUG CONTROLLER

5813

TPS2399D

TPS2399D

Texas Instruments

IC CTLR HOT SWAP -48V 8VSSOP

7680

TPS2399DGK

TPS2399DGK

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

430

MAX5931HEEP

MAX5931HEEP

Analog Devices, Inc.

TRIPLE HOT-SWAP CONTROLLER

3012

ADM1177-1ARMZ-R7

ADM1177-1ARMZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

423

LT4256-2CS8#TRPBF

LT4256-2CS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

9658

MIC2085-JYQS

MIC2085-JYQS

Roving Networks / Microchip Technology

IC HOTSWAP CTR INFINIBAND 16QSOP

120

ISL6141CB

ISL6141CB

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

4853

UCC3917D

UCC3917D

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

8713

ISL61852KIRZ

ISL61852KIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

TPS2491DGSG4

TPS2491DGSG4

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

DS4560S-AR+

DS4560S-AR+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

444500

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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