PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4228CUFD-1#TRPBF

LTC4228CUFD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

MAX5927AETJ+

MAX5927AETJ+

Maxim Integrated

IC HOT SWAP CTRLR GP 32TQFN

25

MAX5903LCEUT

MAX5903LCEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

0

ISL6141CBZA

ISL6141CBZA

Intersil (Renesas Electronics America)

POWER SUPPLY SUPPORT CIRCUIT, AD

2165

LTC1643AL-1CGN#PBF

LTC1643AL-1CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

250

ISL61853GIRZ

ISL61853GIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX8533EUB+

MAX8533EUB+

Analog Devices, Inc.

MAX8533 SMALLEST, MOST RELIABLE,

6340

MAX5931AEEP+T

MAX5931AEEP+T

Maxim Integrated

IC HOT SWAP CTRLR GP 20QSOP

0

MAX5902LCETT+T

MAX5902LCETT+T

Analog Devices, Inc.

HOT-SWAP CONTROLLER

5000

LTC4216CMS#PBF

LTC4216CMS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

51

TPS24712DGS

TPS24712DGS

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

LM5066PMHX/NOPB

LM5066PMHX/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 28HTSSOP

549

ISL61853ICRZ-T

ISL61853ICRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4210-3IS6#TRMPBF

LTC4210-3IS6#TRMPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP TSOT23-6

361

LTC4215CUFD-2#PBF

LTC4215CUFD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

112

UCC3915DPG4

UCC3915DPG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

LTC4225IUFD-1#PBF

LTC4225IUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

146

ISL61853LCRZ

ISL61853LCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

TPS2350D

TPS2350D

Texas Instruments

TPS2350 HOT SWAP POWER MANAGER F

1488

ADM1172-1AUJZ-RL7

ADM1172-1AUJZ-RL7

Analog Devices, Inc.

2.7V TO 16.5V HOT SWAP CONTROLLE

13821

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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