PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5920BESA+

MAX5920BESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

261

ISL61862AIRZ

ISL61862AIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

MIC2586R-2YM

MIC2586R-2YM

Roving Networks / Microchip Technology

HOT SWAP POWER CONTROLLER

302

TPS2358RGZR

TPS2358RGZR

Texas Instruments

IC HOT SWAP CTRLR ATCA 48VQFN

0

ISL61852CCRZ-T

ISL61852CCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

MAX5954AETX+T

MAX5954AETX+T

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 36TQFN

0

TPS2458RHBR

TPS2458RHBR

Texas Instruments

TPS2458 12V / 3.3V HOT SWAP AND

8126

LTC4261CGN-2#PBF

LTC4261CGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28SSOP

0

LTC4245CUHF#PBF

LTC4245CUHF#PBF

Analog Devices, Inc.

MULTIPLE SUPPLY HOT SWAP CONTROL

27

LTC4227CGN-1#PBF

LTC4227CGN-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

7

ISL61853IIRZ

ISL61853IIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5903ACETT+T

MAX5903ACETT+T

Maxim Integrated

IC HOT SWAP CTRLR GP 6TDFN

0

LT1640HIN8#PBF

LT1640HIN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

0

MAX5948AESA

MAX5948AESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

1680

MAX15162AATG+

MAX15162AATG+

Maxim Integrated

60V DUAL EFUSE FOR PA

459

LT4254CGN#PBF

LT4254CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

600

MIC2583-JYQS-TR

MIC2583-JYQS-TR

Roving Networks / Microchip Technology

IC HOT SWAP CTRLR GP 16QSOP

0

LTC4281IUFD#PBF

LTC4281IUFD#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

LTC4234CWHH#PBF

LTC4234CWHH#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

LTC1421CSW-2.5#TRPBF

LTC1421CSW-2.5#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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