Memory - Configuration Proms for FPGAs

Image Part Number Description / PDF Quantity Rfq
AT17C010A-10QC

AT17C010A-10QC

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 1M 32TQFP

0

AT17LV002A-10JI

AT17LV002A-10JI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 2M 20-PLCC

0

AT17LV002A-10CU

AT17LV002A-10CU

Roving Networks / Microchip Technology

IC FPGA EEPROM 2M ALTERA 8LAP

0

AT17LV040A-10BJC

AT17LV040A-10BJC

Roving Networks / Microchip Technology

IC SRL CONFG EEPROM 4M LV 44PLCC

0

XC1765EPDG8C

XC1765EPDG8C

Xilinx

IC PROM SERIAL CONFIG 65K 8-DIP

0

AT17LV002-10SC

AT17LV002-10SC

Roving Networks / Microchip Technology

IC EEPROM SRL CONFG 2M LV 20SOIC

0

EPC1441TC32N

EPC1441TC32N

Intel

IC CONFIG DEVICE 440KBIT 32TQFP

0

AT17C010A-10PC

AT17C010A-10PC

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 1M 8DIP

0

AT17C128-10NI

AT17C128-10NI

Roving Networks / Microchip Technology

IC EEPROM FPGA 128KB 8-SOIC

0

EPCS64SI16NGA

EPCS64SI16NGA

Intel

IC CONFIG DEVICE

0

XC17S30VO8I

XC17S30VO8I

Xilinx

IC PROM SER 300K 8-SOIC

0

EPC1441PC8

EPC1441PC8

Intel

IC CONFIG DEVICE 400KBIT 8DIP

0

AT17N040-10TQI

AT17N040-10TQI

Roving Networks / Microchip Technology

IC FPGA 4M CONFIG MEM 44TQFP

0

AT17C512-10CI

AT17C512-10CI

Roving Networks / Microchip Technology

IC SRL CONFIG EEPROM 512K 8LAP

0

XC17S100AVOG8C

XC17S100AVOG8C

Xilinx

IC PROM SERIAL 100K 8-SOIC

0

XC17S20PD8I

XC17S20PD8I

Xilinx

IC PROM PROG I-TEMP 5V 8-DIP

0

AT17F16-30JI

AT17F16-30JI

Roving Networks / Microchip Technology

IC FLASH CONFIG 16M 20PLCC

0

EPC2LI20

EPC2LI20

Intel

IC CONFIG DEVICE 1.6MBIT 20PLCC

0

XC17V04VQ44C

XC17V04VQ44C

Xilinx

IC PROM SER 4MBIT 3.3V 44-VQFP

0

EPCQ512SI16N

EPCQ512SI16N

Intel

IC QUAD-SERIAL CONFIG DEVICE 512

0

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
OTP PROMsOne-Time Programmable, low cost, high reliabilityIndustrial control systems
Flash PROMsReprogrammable, high density, moderate endurance5G base stations
EEPROMByte-alterable, high endurance, slower access speedMedical imaging equipment
FRAMLow-power, radiation-hardened, fast write speedAerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

  • Package types: TSSOP, VQFN, BGA
  • Memory array: Floating-gate or antifuse-based technology
  • Interface: SPI, BPI, or parallel bus
  • Voltage rails: 1.2V-3.3V operation with decoupling capacitors
  • Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

ParameterSignificance
Memory density (1Mb-4Gb)Determines maximum FPGA configuration size
Access time (55ns-120ns)Impacts system boot speed
Endurance (10k-100k cycles)Dictates reprogramming lifespan
Data retention (20-100 years)Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)Essential for space applications

5. Application Areas

Primary application domains:

  • Telecommunications: 5G NR base stations, optical transceivers
  • Industrial: Programmable logic controllers (PLCs)
  • Medical: MRI scanners, patient monitoring systems
  • Automotive: ADAS sensor fusion units
  • Defense: Radar signal processing systems

6. Key Manufacturers and Products

ManufacturerProduct SeriesKey Features
MicrochipAT17F Series128Mb SPI interface, -40 C to +125 C
IntelEP180SSecure boot, TSMC 16nm process
XilinxS25FL-VOctal SPI, 400MHz clock rate
CypressFL-S SeriesEnd-to-end data protection

7. Selection Guidelines

Key selection factors:

  • Match memory density to target FPGA's bitstream size
  • Verify interface compatibility (SPI/BPI/parallel)
  • Evaluate environmental requirements (temperature, radiation)
  • Assess security features (encryption, authentication)
  • Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

  • Transition to 3D NAND architecture for densities beyond 8Gb
  • Integration of hardware security modules (HSM)
  • Adoption of JEDEC Xccela interface for >400MB/s throughput
  • Development of radiation-tolerant devices for LEO satellites
  • Implementation of AI-driven wear-leveling algorithms
RFQ BOM Call Skype Email
Top