Memory - Configuration Proms for FPGAs

Image	Part Number	Description / PDF	Quantity	Rfq
	XC17256EPCG20C Xilinx	IC PROM SERIAL 256K 20-PLCC	0
	XC17V04PC44I Xilinx	IC PROM SER 4MBIT 3.3V 44-PLCC	0
	AT18F040-30XU Roving Networks / Microchip Technology	IC FLASH CONFIG 4MBIT 20-TSSOP	0
	EPC1441PI8 Intel	IC CONFIG DEVICE 400KBIT 8DIP	0
	EPCQ64SI16N Intel	IC CONFIG DEVICE 64MBIT 16SOIC	0
	AT17LV256-10CI Roving Networks / Microchip Technology	IC SRL CONFIG EEPROM 256K 8-LAP	0
	AT17LV040-10TQI Roving Networks / Microchip Technology	IC CONFIG SEEPROM 4M 3.3V 44TQFP	0
	XC17128EVOG8C Xilinx	IC PROM SERIAL 128K 8-SOIC	0
	XC18V02PC44I Xilinx	IC PROM SER I-TEMP 3.3V 44-PLCC	0
	EPCS64SI16N Intel	IC CONFIG DEVICE 64MBIT 16SOIC	0
	AT17LV512A-10PI Roving Networks / Microchip Technology	IC CONFIG SEEPROM 512K 8DIP	0
	EPC1441TC32 Intel	IC CONFIG DEVICE 440KBIT 32TQFP	0
	AT17LV010-10CC Roving Networks / Microchip Technology	IC SRL CONFIG EEPROM 1M LV 8LAP	0
	XC17S200APDG8C Xilinx	IC PROM SER 200K C-TEMP 8-DIP	0
	EPCQ512ASI16N Intel	IC QUAD-SERIAL CONFIG DEVICE 512	0
	XC17256ELPD8C Xilinx	IC 3V SER CFG PROM 256K 8-DIP	0
	AT17N256-10PC Roving Networks / Microchip Technology	IC FPGA 256K CONFIG MEM 8DIP	0
	EPC16QC100N Intel	IC CONFIG DEVICE 16MBIT 100QFP	0
	AT17F040-30CI Roving Networks / Microchip Technology	IC FLASH CONFIG 4M 8LAP	0
	EPC1441TI32N Intel	IC CONFIG DEVICE 32TQFP	0

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
OTP PROMs	One-Time Programmable, low cost, high reliability	Industrial control systems
Flash PROMs	Reprogrammable, high density, moderate endurance	5G base stations
EEPROM	Byte-alterable, high endurance, slower access speed	Medical imaging equipment
FRAM	Low-power, radiation-hardened, fast write speed	Aerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

Package types: TSSOP, VQFN, BGA
Memory array: Floating-gate or antifuse-based technology
Interface: SPI, BPI, or parallel bus
Voltage rails: 1.2V-3.3V operation with decoupling capacitors
Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

Parameter	Significance
Memory density (1Mb-4Gb)	Determines maximum FPGA configuration size
Access time (55ns-120ns)	Impacts system boot speed
Endurance (10k-100k cycles)	Dictates reprogramming lifespan
Data retention (20-100 years)	Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)	Essential for space applications

5. Application Areas

Primary application domains:

Telecommunications: 5G NR base stations, optical transceivers
Industrial: Programmable logic controllers (PLCs)
Medical: MRI scanners, patient monitoring systems
Automotive: ADAS sensor fusion units
Defense: Radar signal processing systems

6. Key Manufacturers and Products

Manufacturer	Product Series	Key Features
Microchip	AT17F Series	128Mb SPI interface, -40 C to +125 C
Intel	EP180S	Secure boot, TSMC 16nm process
Xilinx	S25FL-V	Octal SPI, 400MHz clock rate
Cypress	FL-S Series	End-to-end data protection

7. Selection Guidelines

Key selection factors:

Match memory density to target FPGA's bitstream size
Verify interface compatibility (SPI/BPI/parallel)
Evaluate environmental requirements (temperature, radiation)
Assess security features (encryption, authentication)
Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

Transition to 3D NAND architecture for densities beyond 8Gb
Integration of hardware security modules (HSM)
Adoption of JEDEC Xccela interface for >400MB/s throughput
Development of radiation-tolerant devices for LEO satellites
Implementation of AI-driven wear-leveling algorithms