Memory

Part Number	Description / PDF	Quantity
MT53E256M32D2DS-046 AIT:B TR Micron Technology	IC DRAM 8GBIT 2.133GHZ 200WFBGA	0
MT29E1T08CMHBBJ4-3:B Micron Technology	IC FLASH 1TB PARALLEL 132VBGA	0
MT49H32M18CSJ-18:B Micron Technology	IC DRAM 576MBIT PARALLEL 144FBGA	0
MT29F8G08ABACAH4-IT:C TR Micron Technology	IC FLASH 8GBIT PARALLEL 63VFBGA	0
MT29F2T08EMHAFJ4-3ITFES:A TR Micron Technology	IC FLASH 2TB PARALLEL 132VBGA	0
MT58L256L32PS-6 Micron Technology	CACHE SRAM, 256KX32, 3.5NS PQFP1	21075
MT46H32M32LFB5-5 IT:B TR Micron Technology	IC DRAM 1GBIT PARALLEL 90VFBGA	732
MT29F8G08ADADAH4-IT:D Micron Technology	IC FLASH 8GBIT PARALLEL 63VFBGA	18
MT55L256L18P1T-7.5TR Micron Technology	SRAM 3.3V 4M-BIT 256KX18 4.2NS	2000
MT28EW256ABA1LPC-0SIT Micron Technology	IC FLASH 256MBIT PARALLEL 64LBGA	0
MT58L64L18FT-7.5 Micron Technology	CACHE SRAM 64KX18 7.5NS PQFP100	9402
MT58V512V36FF-7.5 Micron Technology	CACHE SRAM, 512KX36, 7.5NS, CMOS	42
MT48LC4M32B2P-6A:L Micron Technology	IC DRAM 128MBIT PAR 86TSOP II	31
MT53E256M32D2DS-053 AIT:B TR Micron Technology	IC DRAM 8GBIT 1.866GHZ 200WFBGA	0
MT29F256G08CBCBBJ4-5M:B TR Micron Technology	IC FLASH 256GBIT PAR 132VBGA	0
MT47H128M16RT-25E IT:C Micron Technology	IC DRAM 2GBIT PARALLEL 84FBGA	4874
MTFC8GAKAJCN-4M IT TR Micron Technology	IC FLASH 64GBIT MMC 153VFBGA	0
MT28EW256ABA1HPC-0SIT Micron Technology	IC FLASH 256MBIT PARALLEL 64LBGA	0
MT25QL128ABA1EW7-0SIT Micron Technology	IC FLASH 128MBIT SPI 8WPDFN	0
MT29F4G08ABBDAH4-IT:D TR Micron Technology	IC FLASH 4GBIT PARALLEL 63VFBGA	1920

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)