Memory

Part Number	Description / PDF	Quantity
S25FL128SDPMFV013 Cypress Semiconductor	IC FLASH 128MBIT SPI/QUAD 16SOIC	0
CY7C1355C-133AXC Cypress Semiconductor	IC SRAM 9MBIT PARALLEL 100TQFP	1
CY7C1426KV18-300BZCT Cypress Semiconductor	IC SRAM 36MBIT PARALLEL 165FBGA	0
S29GL032N90FFIS20 Cypress Semiconductor	IC FLASH 32MBIT PARALLEL 64FBGA	720
CY14B116N-BZ25XI Cypress Semiconductor	NO WARRANTY	71
CY62156ESL-45BVXIT Cypress Semiconductor	IC SRAM 8MBIT PARALLEL 48VFBGA	0
CY14B104NA-BA25XIT Cypress Semiconductor	IC NVSRAM 4MBIT PARALLEL 48FBGA	0
CY7C1381KV33-133AXIT Cypress Semiconductor	IC SRAM 18MBIT PARALLEL 100TQFP	0
FM24CL16B-DGTR Cypress Semiconductor	IC FRAM 16KBIT I2C 1MHZ 8TDFN	0
CY7C1020D-10ZSXIT Cypress Semiconductor	IC SRAM 512KBIT PAR 44TSOP II	0
S29GL128P11FAI020 Cypress Semiconductor	IC FLASH 128MBIT PARALLEL 64FBGA	0
CY15B102Q-SXE Cypress Semiconductor	IC FRAM 2MBIT SPI 25MHZ 8SOIC	62
S29AS008J70TFI043 Cypress Semiconductor	IC FLASH 8MBIT PARALLEL 48TSOP	0
S29GL064S70FHI010 Cypress Semiconductor	IC FLASH 64MBIT PARALLEL 64FBGA	63
S29GL512S10DHI010 Cypress Semiconductor	IC FLASH 512MBIT PARALLEL 64FBGA	3
S25FS512SDSBHV213 Cypress Semiconductor	IC FLASH 512MBIT SPI/QUAD 24BGA	1940
CY62147G30-45ZSXA Cypress Semiconductor	IC SRAM 4MBIT PARALLEL 44TSOP II	0
S29GL032N90BAI030 Cypress Semiconductor	IC FLASH 32MBIT PARALLEL 48FBGA	0
S29CL016J0JQFM030 Cypress Semiconductor	IC FLASH 16MBIT PARALLEL 80PQFP	0
CY7C1460KV25-167AXC Cypress Semiconductor	IC SRAM 36MBIT PARALLEL 100TQFP	0

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)