Memory

Part Number	Description / PDF	Quantity
71T75602S150BG Renesas Electronics America	IC SRAM 18MBIT PARALLEL 119PBGA	0
71V416S12PHGI8 Renesas Electronics America	IC SRAM 4MBIT PARALLEL 44TSOP II	3660
71V3557S80PFG8 Renesas Electronics America	IC SRAM 4.5MBIT PARALLEL 100TQFP	0
70V658S15BC Renesas Electronics America	IC SRAM 2MBIT PARALLEL 256CABGA	0
71V416S10YG8 Renesas Electronics America	IC SRAM 4MBIT PARALLEL 44SOJ	0
71016S15PHGI Renesas Electronics America	IC SRAM 1MBIT PARALLEL 44TSOP II	20
70V657S10DRG Renesas Electronics America	IC SRAM 1.125MBIT PAR 208PQFP	0
UPD46365362BF1-E40Y-EQ1-A Renesas Electronics America	QDR SRAM, 1MX36, 0.45NS	290
70V7519S166BCI8 Renesas Electronics America	IC SRAM 9MBIT PARALLEL 256CABGA	0
7164L85DB Renesas Electronics America	IC SRAM 64KBIT PARALLEL 28CERDIP	20
71V424L12YG Renesas Electronics America	IC SRAM 4MBIT PARALLEL 36SOJ	0
71V65603S133BQI Renesas Electronics America	IC SRAM 9MBIT PARALLEL 165CABGA	0
UPD44325362BF5-E40X-FQ1-A Renesas Electronics America	QDR SRAM, 1MX36, 0.45NS	634
71V124SA15TYGI8 Renesas Electronics America	IC SRAM 1MBIT PARALLEL 32SOJ	0
71V3579S85PFGI Renesas Electronics America	IC SRAM 4.5MBIT PARALLEL 100TQFP	0
71024S15TYGI8 Renesas Electronics America	IC SRAM 1MBIT PARALLEL 32SOJ	1102
UPD44165184BF5-E33-EQ3-A Renesas Electronics America	QDR SRAM, 1MX18, 0.45NS	0
UPD44645362AF5-E40X-FQ1-A Renesas Electronics America	STANDARD SRAM, 2MX36, 0.45NS	255
71V65703S85BQG8 Renesas Electronics America	IC SRAM 9MBIT PARALLEL 165CABGA	0
70T651S12BFI8 Renesas Electronics America	IC SRAM 9MBIT PARALLEL 208CABGA	0

Memory

1. Overview

Memory integrated circuits (ICs) are semiconductor devices used for storing digital data in electronic systems. As fundamental components of modern electronics, they enable data retention and retrieval in computers, mobile devices, industrial equipment, and automotive systems. Memory ICs are categorized into volatile (requires power to retain data) and non-volatile (retains data without power) types, playing critical roles in system performance, storage capacity, and energy efficiency.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
DRAM (Dynamic RAM)	High-density, low-cost, requires periodic refresh	PCs, Servers, Graphics Cards
NAND Flash	Non-volatile, high endurance, block-level access	SSDs, USB Drives, Mobile Storage
SRAM (Static RAM)	High-speed, low density, no refresh required	Cache Memory, Networking Equipment
NOR Flash	Random access, execute-in-place capability	Embedded Systems, Automotive ECUs
MRAM (Magnetoresistive RAM)	Non-volatile, unlimited endurance, low power	IoT Devices, Industrial Sensors

3. Structure and Composition

Memory ICs typically consist of:

Storage Cell Array: Matrix of memory cells (transistors/capacitors for DRAM, floating-gate transistors for Flash)
Address Decoder: Selects specific memory locations
I/O Circuits: Data input/output interfaces
Control Logic: Manages read/write operations and timing
Power Management Units: Optimizes energy consumption

Advanced packages include BGA (Ball Grid Array) and 3D-stacked configurations for density optimization.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	Data volume (Gb/GiB)	Determines system memory limits
Access Time	ns/predictable latency	Impacts processing speed
Power Consumption	mW/MHz	Affects battery life and thermal design
Endurance	P/E cycles (Flash)	Dictates product lifespan
Data Retention	Years (non-volatile)	Critical for long-term storage

5. Application Areas

Consumer Electronics: Smartphones (NAND Flash), Gaming Consoles (GDDR6)
Industrial Automation: PLCs (SRAM), Data Loggers (MRAM)
Automotive Systems: ADAS (LPDDR5), Infotainment (eMMC)
Enterprise Storage: SSD Controllers (3D NAND), Servers (RDIMM)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Samsung Electronics	V-NAND (9x-layer), LPDDR5X
SK hynix	HBM3 (8GB/s bandwidth), GDDR6
Microchip Technology	Serial NOR Flash (SST26)
Kioxia Corporation	BiCS FLASH (3D NAND)
Infineon Technologies	MRAM (40nm process)

7. Selection Recommendations

Key considerations:

Match memory type to application requirements (e.g., NOR Flash for code storage)
Evaluate bandwidth vs. latency tradeoffs
Analyze temperature and vibration specifications
Assess long-term supply stability
Optimize cost-per-bit metrics

Case Study: A smartphone manufacturer selected UFS 3.1 (NAND-based) for 2100MB/s read speeds, improving app launch times by 35%.

8. Industry Trends

Future directions include:

3D NAND scaling beyond 200 layers
Emerging memories (ReRAM, PCM) for AI acceleration
Package-on-Package (PoP) integration
AI-optimized memory architectures (Processing-in-Memory)
Green manufacturing processes (EUV lithography)