Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
HI1-5046A-7

HI1-5046A-7

DPDT ANALOG SWITCH, 25 OHMS

1489

CD54HCT4052F3A

CD54HCT4052F3A

ANALOG MUX/DEMUX

0

CY74FCT2257ATQCT

CY74FCT2257ATQCT

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16SSOP

2480

74VHCT138ASJX

74VHCT138ASJX

IC DECODER/DEMUX 1X3:8 16SOP

2272

FST3383WM

FST3383WM

BUS EXCHANGER

1260

54S258DM

54S258DM

MULTIPLEXER 2 LINE INPUT, TTL

514

74ACT253MTCX

74ACT253MTCX

IC MULTIPLEXER 2 X 4:1 16TSSOP

2315

DM74ALS251MX

DM74ALS251MX

IC MULTIPLEXER 1 X 8:1 16SOIC

34333

SN74AHCT158NSR

SN74AHCT158NSR

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16SO

2000

MC10EP56DTR2

MC10EP56DTR2

IC DIFF DIG MULTPL 2X2:1 20TSSOP

7500

SN74HCT138PWRE4

SN74HCT138PWRE4

Texas Instruments

IC DECODER/DEMUX 1X3:8 16TSSOP

0

CD74HC154M

CD74HC154M

Texas Instruments

IC DECODER/DEMUX 1X4:16 24SOIC

949

QS32XL384Q1G

QS32XL384Q1G

Renesas Electronics America

IC BUS SWITCH 2 X 10:10 48QSOP

4488

SN74CBTLV3857DW

SN74CBTLV3857DW

Texas Instruments

IC BUS SWITCH 10 X 1:1 24SOIC

70175

HI1-5040-5

HI1-5040-5

SPST ANALOG SWITCH, 50 OHMS

0

SN74CB3T3383DW

SN74CB3T3383DW

Texas Instruments

IC BUS FET EXCHG SW 5X2:2 24SOIC

22280

SN74LVC157APWE4

SN74LVC157APWE4

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16TSSOP

780

SN74ALS158D

SN74ALS158D

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16SOIC

16255

MC14515BDWR2G

MC14515BDWR2G

Sanyo Semiconductor/ON Semiconductor

IC DECODER/DEMUX 1X4:16 24SOIC

729

SY58023UMG-TR

SY58023UMG-TR

Roving Networks / Microchip Technology

IC CROSSPOINT SW 1 X 2:2 16MLF

0

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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