Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
SN74CBTLV3245APW

SN74CBTLV3245APW

Texas Instruments

IC BUS SWITCH 8 X 1:1 20TSSOP

459

SN74CBTH16211DL

SN74CBTH16211DL

Texas Instruments

IC BUS SWITCH 12 X 1:1 56SSOP

7790

HA4201CB

HA4201CB

Intersil (Renesas Electronics America)

CROSS POINT SWITCH, 1 FUNC

4789

QS3VH16862PAG

QS3VH16862PAG

Renesas Electronics America

IC BUS SWITCH 5 X 1:1 48TSSOP

7585

TCA9546ADR

TCA9546ADR

Texas Instruments

IC BUS SWITCH 2 X 1:4 16SOIC

2435

TC7MBL3253CFT(EL)

TC7MBL3253CFT(EL)

Toshiba Electronic Devices and Storage Corporation

IC MUX/DEMUX 2 X 4:1 16TSSOP

0

JM38510/33904B2A

JM38510/33904B2A

MUX, F/FAST SERIES

2765

MC74AC157M

MC74AC157M

MUX, AC SERIES

4200

SN74LVC257APWT

SN74LVC257APWT

Texas Instruments

IC MULTIPLEXER 4 X 2:1 16TSSOP

2000

CD74HCT238E

CD74HCT238E

Texas Instruments

IC DECODER/DEMUX 1X3:8 16DIP

1545

CD74HC237MT

CD74HC237MT

Texas Instruments

IC DECODER/DEMUX 1X3:8 16SOIC

750

SN74CBT3306PWR

SN74CBT3306PWR

Texas Instruments

IC BUS SWITCH 1 X 1:1 8TSSOP

903

MC74F257AD

MC74F257AD

MULTIPLEXER BIPOLAR 3-ST 8-IN 16

4254

74AC153SC

74AC153SC

IC MULTIPLEXER 2 X 4:1 16SOIC

0

MC74ACT138MEL

MC74ACT138MEL

DECODER/DEMUX SINGLE 3-TO-8

12000

74HCT147D,653

74HCT147D,653

NXP Semiconductors

IC PRIORITY ENCOD 1 X 10:4 16SO

1332

SN74CBT16213DLR

SN74CBT16213DLR

Texas Instruments

IC BUS FET EXCH SW 12X2:2 56SSOP

6500

MAX4550EWI

MAX4550EWI

Analog Devices, Inc.

DUAL 4X2 AUDIO/VIDEO XPOINT S/W

284

DM74LS138SJ

DM74LS138SJ

DECIMAL DECODER, LS SERIES

2393

74AHCT157D,112

74AHCT157D,112

Nexperia

IC MULTIPLEXER 4 X 2:1 16SO

0

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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