Logic - Flip Flops

Part Number	Description / PDF	Quantity
SN74AHC574PWRE4 Texas Instruments	IC FF D-TYPE SNGL 8BIT 20TSSOP	0
MC74VHCT574ADW	BUS DRIVER	1061
74107DC	J-K FLIP-FLOP	0
74AC11112D Texas Instruments	J-K FLIP-FLOP	1025
SN74LVTH16374GQLR Texas Instruments	BUS DRIVER, LVT SERIES	5000
100331DC	D FLIP-FLOP, 100K SERIES	993
MC74HC73ADTR2G Sanyo Semiconductor/ON Semiconductor	IC FF JK TYPE DUAL 1BIT 14TSSOP	2539
74LVCH16374APAG Renesas Electronics America	74LVCH16374 - 3.3V CMOS 16-BIT E	9404
CY74FCT823ATSOCT Texas Instruments	BUS DRIVER	12000
SN74ABT574APWR Texas Instruments	IC FF D-TYPE SNGL 8BIT 20TSSOP	2503
MC74HCT273ADW	HCT SERIES, 1 FUNC, POSITIVE EDG	15867
CY74FCT374ATPC Texas Instruments	IC FF D-TYPE SNGL 8BIT 20DIP	840
SN74LVTH574DBR Texas Instruments	IC FF D-TYPE SNGL 8BIT 20SSOP	0
SN74AHC574DWR Texas Instruments	IC FF D-TYPE SNGL 8BIT 20SOIC	3097
SNJ54F74J Texas Instruments	54F74 DUAL POSITIVE-EDGE-TRIGGER	209
SN74LVTH32374GKER Texas Instruments	BUS DRIVER, LVT SERIES	92727
SN74ALS109ANSR Texas Instruments	IC FF JK TYPE DUAL 1BIT 16SO	1990
74HC174D,652 Nexperia	IC FF D-TYPE SNGL 6BIT 16SO	384
MC74VHC74ML1	D FLIP-FLOP	34807
JM38510/30102SCA Texas Instruments	54LS74 - DUAL FLIP-FLOP, POSITIV	41

Logic - Flip Flops

1. Overview

Flip flops are fundamental building blocks in digital electronics, serving as bistable multivibrators capable of storing one bit of data. They form the basis of sequential logic circuits, enabling data storage, synchronization, and state control. Their ability to maintain stable states until triggered by clock signals makes them critical in memory units, counters, and register files. Modern computing, telecommunications, and automation systems rely heavily on flip flops for reliable data management and timing control.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
SR Flip Flop	Set-Reset operation with undefined state when both inputs activate	Basic memory elements, control circuits
D Flip Flop	Data storage with single data input synchronized by clock edge	Registers, shift registers, data buffers
JK Flip Flop	Universal type eliminating invalid states through feedback	Counters, frequency dividers, state machines
T Flip Flop	Toggle state with each clock pulse when input active	Binary counters, clock division circuits

3. Structure and Composition

Flip flops are typically constructed using transistor-transistor logic (TTL) or complementary metal-oxide-semiconductor (CMOS) technologies. A standard CMOS D flip flop contains 8-12 transistors arranged in master-slave configuration with transmission gates. Key components include:

Clock signal input for synchronization
Data input/output terminals
Feedback paths for state retention
Level-sensitive or edge-triggered control circuitry

4. Key Technical Specifications

Parameter	Typical Range	Importance
Clock Frequency	DC to 10GHz (varies by technology)	Determines maximum operating speed
Propagation Delay	1-10ns (CMOS), 3-20ns (TTL)	Impacts circuit timing margins
Power Consumption	1mW-100mW per flip flop	Critical for battery-powered devices
Setup/Hold Time	0.1-2ns	Essential for reliable data capture
Output Drive Strength	2mA-24mA	Affects fan-out capability

5. Application Domains

Telecommunications: Synchronization circuits in 5G base stations, optical transceivers
Computing: CPU register files, cache memory controllers
Industrial Control: Programmable logic controllers (PLCs), sensor interfaces
Consumer Electronics: Timing circuits in smartphones, wearable devices
Automotive: CAN bus controllers, ADAS synchronization modules

6. Leading Manufacturers and Products

Manufacturer	Representative Products	Key Features
Texas Instruments	SN74LVC1G80	Single D flip flop with 14ns delay, 2GHz clock rate
STMicroelectronics	STM74HC74ADG	Dual D flip flop with 8mA drive, 125MHz operation
NXP Semiconductors	74AUP1G175GF	Low-power quad D flip flop, 0.9V-3.6V operation
Intel	IOP333B00ES	High-speed differential flip flops for FPGA interfaces

7. Selection Guidelines

Key selection criteria include:

Speed requirements vs. power budget trade-offs
Compatibility with existing logic families (TTL/CMOS)
Package type (QFP, BGA, WLCSP) for PCB constraints
Environmental specifications (temperature range, radiation hardness)
Integration level (discrete vs. embedded in FPGAs/ASICs)

Example: For high-speed networking equipment, select flip flops with <1ns jitter and LVDS compatibility.

8. Industry Trends

Current development trends include:

Migration to FinFET and GAAFET transistor structures for sub-5nm nodes
Integration with on-die clocking networks in 3D-stacked ICs
Emergence of spin-transfer torque flip flops for non-volatile memory
Adoption of photonics-ready flip flops for optical computing interfaces
Development of ultra-low-voltage ( 0.5V) flip flops for IoT applications