Logic - Flip Flops

Part Number	Description / PDF	Quantity
HEC4013BT,118 Nexperia	D FLIP-FLOP, 4000/14000/40000 SE	3546
54F175DC	D FLIP-FLOP, F/FAST SERIES TTL	123
54174FM	D FLIP-FLOP, TTL	6403
CY74FCT574ATSOCT Texas Instruments	BUS DRIVER, FCT SERIES, 1 FUNC,	22000
74AUP2G80GM,125 NXP Semiconductors	NOW NEXPERIA 74AUP2G80GM - D FLI	118171
CD74HC273E Texas Instruments	IC FF D-TYPE SNGL 8BIT 20DIP	3767
74LV74DB,118 Nexperia	IC FF D-TYPE DUAL 1BIT 14SSOP	0
74ACT16823DLR Texas Instruments	74ACT16823 18-BIT BUS-INTERFACE	17875
CY74FCT823BTPC Texas Instruments	BUS DRIVER	1200
SN74HCT574NSR Texas Instruments	IC FF D-TYPE SNGL 8BIT 20SO	1844
CD4013BM96E4 Texas Instruments	IC FF D-TYPE DUAL 1BIT 14SOIC	0
SN74AUC1G74DCURE4 Texas Instruments	IC FF D-TYPE SNGL 1BIT 8VSSOP	0
SN74LVC374ANSRG4 Texas Instruments	SN74LVC374A OCTAL EDGE-TRIGGERED	1900
SN74ALVCH162721DL Texas Instruments	BUS DRIVER	10051
74LV377PW,118 NXP Semiconductors	D FLIP-FLOP	2360
CY74FCT377ATSOCT Texas Instruments	D FLIP-FLOP	4000
SN74ALS74AD Texas Instruments	IC FF D-TYPE DUAL 1BIT 14SOIC	522
CD54HCT574F3A Texas Instruments	CD54HCT574 HIGH SPEED CMOS LOGIC	0
74LCX574MSAX	BUS DRIVER	639
SN74ABT823DWR Texas Instruments	SN74ABT823 9-BIT BUS-INTERFACE F	4651

Logic - Flip Flops

1. Overview

Flip flops are fundamental building blocks in digital electronics, serving as bistable multivibrators capable of storing one bit of data. They form the basis of sequential logic circuits, enabling data storage, synchronization, and state control. Their ability to maintain stable states until triggered by clock signals makes them critical in memory units, counters, and register files. Modern computing, telecommunications, and automation systems rely heavily on flip flops for reliable data management and timing control.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
SR Flip Flop	Set-Reset operation with undefined state when both inputs activate	Basic memory elements, control circuits
D Flip Flop	Data storage with single data input synchronized by clock edge	Registers, shift registers, data buffers
JK Flip Flop	Universal type eliminating invalid states through feedback	Counters, frequency dividers, state machines
T Flip Flop	Toggle state with each clock pulse when input active	Binary counters, clock division circuits

3. Structure and Composition

Flip flops are typically constructed using transistor-transistor logic (TTL) or complementary metal-oxide-semiconductor (CMOS) technologies. A standard CMOS D flip flop contains 8-12 transistors arranged in master-slave configuration with transmission gates. Key components include:

Clock signal input for synchronization
Data input/output terminals
Feedback paths for state retention
Level-sensitive or edge-triggered control circuitry

4. Key Technical Specifications

Parameter	Typical Range	Importance
Clock Frequency	DC to 10GHz (varies by technology)	Determines maximum operating speed
Propagation Delay	1-10ns (CMOS), 3-20ns (TTL)	Impacts circuit timing margins
Power Consumption	1mW-100mW per flip flop	Critical for battery-powered devices
Setup/Hold Time	0.1-2ns	Essential for reliable data capture
Output Drive Strength	2mA-24mA	Affects fan-out capability

5. Application Domains

Telecommunications: Synchronization circuits in 5G base stations, optical transceivers
Computing: CPU register files, cache memory controllers
Industrial Control: Programmable logic controllers (PLCs), sensor interfaces
Consumer Electronics: Timing circuits in smartphones, wearable devices
Automotive: CAN bus controllers, ADAS synchronization modules

6. Leading Manufacturers and Products

Manufacturer	Representative Products	Key Features
Texas Instruments	SN74LVC1G80	Single D flip flop with 14ns delay, 2GHz clock rate
STMicroelectronics	STM74HC74ADG	Dual D flip flop with 8mA drive, 125MHz operation
NXP Semiconductors	74AUP1G175GF	Low-power quad D flip flop, 0.9V-3.6V operation
Intel	IOP333B00ES	High-speed differential flip flops for FPGA interfaces

7. Selection Guidelines

Key selection criteria include:

Speed requirements vs. power budget trade-offs
Compatibility with existing logic families (TTL/CMOS)
Package type (QFP, BGA, WLCSP) for PCB constraints
Environmental specifications (temperature range, radiation hardness)
Integration level (discrete vs. embedded in FPGAs/ASICs)

Example: For high-speed networking equipment, select flip flops with <1ns jitter and LVDS compatibility.

8. Industry Trends

Current development trends include:

Migration to FinFET and GAAFET transistor structures for sub-5nm nodes
Integration with on-die clocking networks in 3D-stacked ICs
Emergence of spin-transfer torque flip flops for non-volatile memory
Adoption of photonics-ready flip flops for optical computing interfaces
Development of ultra-low-voltage ( 0.5V) flip flops for IoT applications