Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
SN74ACT722331L50RJ

SN74ACT722331L50RJ

Texas Instruments

FIFO MEMORY

480

SN74ACT7201LA25RJ

SN74ACT7201LA25RJ

Texas Instruments

FIFO MEM ASYNC 512 X 9

11069

SN74ACT7202LA35RJ

SN74ACT7202LA35RJ

Texas Instruments

FIFO MEM ASYNC 16K X 9

480

74ACT7201LA50DVR

74ACT7201LA50DVR

Texas Instruments

FIFO, 512X9, 15NS, ASYNCHRONOUS

4000

SN74ACT7810-15FN

SN74ACT7810-15FN

Texas Instruments

FIFO,SYNCHRONOUS, CMOS

822

SN74ACT7807-25PAC

SN74ACT7807-25PAC

Texas Instruments

FIFO, 2KX9, 18NS, SYNCHRONOUS

0

SN74V283-15GGM

SN74V283-15GGM

Texas Instruments

IC SYNC FIFO MEM 32768X18 100BGA

0

SN74ALVC7804-25DLR

SN74ALVC7804-25DLR

Texas Instruments

IC MEMORY FIFO 512X18 56-SSOP

0

SN74ALVC7803-40DLR

SN74ALVC7803-40DLR

Texas Instruments

IC MEMORY FIFO 512X18 56-SSOP

0

SN74V3660-15PEU

SN74V3660-15PEU

Texas Instruments

IC FIFO 8KX18 128QFP

0

SN74ALVC7806-40DLR

SN74ALVC7806-40DLR

Texas Instruments

IC MEMORY FIFO 256X18 56-SSOP

0

SN74ALVC7806-25DLR

SN74ALVC7806-25DLR

Texas Instruments

IC MEMORY FIFO 256X18 56-SSOP

0

SN74ABT7819A-12PH

SN74ABT7819A-12PH

Texas Instruments

IC SYNC FIFO MEM 512X18X2 80-QFP

0

SN74ACT3651-15PCB

SN74ACT3651-15PCB

Texas Instruments

IC CLOCKED FIFO MEMORY 120HLQFP

0

SN74ABT7819A-10PH

SN74ABT7819A-10PH

Texas Instruments

IC SYNC FIFO MEM 512X18X2 80-QFP

0

SN74V283-6GGM

SN74V283-6GGM

Texas Instruments

IC SYNC FIFO MEM 32768X18 100BGA

0

SN74V293-10GGM

SN74V293-10GGM

Texas Instruments

IC SYNC FIFO MEM 65536X18 100BGA

0

CD74HCT40105M96G4

CD74HCT40105M96G4

Texas Instruments

IC FIFO REGISTER 4X16 16SOIC

0

SN74V273-10GGM

SN74V273-10GGM

Texas Instruments

IC SYNC FIFO 16KX18 100BGA

0

SN74ALVC7814-25DLR

SN74ALVC7814-25DLR

Texas Instruments

IC MEMORY FIFO 64X18 56-SSOP

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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