Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
SN74ACT7202LA50RJ

SN74ACT7202LA50RJ

Texas Instruments

FIFO MEM ASYNC 16K X 9

6522

SN74ACT363230PQ

SN74ACT363230PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

0

SN74ACT7201LA20R2

SN74ACT7201LA20R2

Texas Instruments

FIFO, 512X9, ASYNCHRONOUS, CMOS

288

SN74ACT7200L50RL

SN74ACT7200L50RL

Texas Instruments

FIFO MEM ASYNC DUAL DEPTH/WIDTH

480

SN74ACT7205L20RJ

SN74ACT7205L20RJ

Texas Instruments

FIFO, 8KX9, 20NS, ASYNCHRONOUS

3284

SN74V293PZAEP

SN74V293PZAEP

Texas Instruments

IC SYNC FIFO 65536X18 80QFP

53

SN74ACT3631-20DCB

SN74ACT3631-20DCB

Texas Instruments

FIFO, 512X36, 13NS, SYNCHRONOUS

111

SN74ACT3651-20PBC

SN74ACT3651-20PBC

Texas Instruments

BI-DIRECTIONAL FIFO, 2KX36, 11NS

176

5962-9470401QXA

5962-9470401QXA

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

13

SN74ACT7205L35RJ

SN74ACT7205L35RJ

Texas Instruments

FIFO, 8KX9, 35NS, ASYNCHRONOUS

2676

SN74ACT7201LA35RJ

SN74ACT7201LA35RJ

Texas Instruments

FIFO MEM ASYNC 512 X 9

40960

SN74ACT7202LA25DV-M

SN74ACT7202LA25DV-M

Texas Instruments

FIFO, 1KX9, 25NS, ASYNCHRONOUS

394

SN74V293-10PZA

SN74V293-10PZA

Texas Instruments

IC SYNC FIFO MEM 65536X18 80LQFP

75

SN74ACT7206L20RJ

SN74ACT7206L20RJ

Texas Instruments

FIFO, 16KX9, 20NS, ASYNCHRONOUS

3284

74ACT7201LA50RJR

74ACT7201LA50RJR

Texas Instruments

FIFO, 512X9, 15NS, ASYNCHRONOUS

750

SN74V293-15PZAG4

SN74V293-15PZAG4

Texas Instruments

IC FIFO 65536X18 SYNCH 80LQFP

0

SNJ54ABT7819GB

SNJ54ABT7819GB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

7

SN74V293-7PZA

SN74V293-7PZA

Texas Instruments

IC SYNC FIFO MEM 65536X18 80LQFP

27

SN74V293-6PZA

SN74V293-6PZA

Texas Instruments

IC SYNC FIFO MEM 65536X18 80LQFP

303

SN74ACT7808-40 PAG

SN74ACT7808-40 PAG

Texas Instruments

FIFO, 2KX9, 28NS, SYNCHRONOUS

24

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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