Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
7202LA30LB

7202LA30LB

Renesas Electronics America

IC MEM FIFO 1024X9 ASYNC 32LCC

0

72V801L10PFG8

72V801L10PFG8

Renesas Electronics America

IC SYNC FIFO 256X9 10NS 64QFP

0

72V3650L6BB8

72V3650L6BB8

Renesas Electronics America

IC FIFO SS 2048X36 6NS 144-BGA

0

72V263L6BCG8

72V263L6BCG8

Renesas Electronics America

IC FIFO 3.3V SUPERSYNC II 100BGA

0

72V235L15TFGI8

72V235L15TFGI8

Renesas Electronics America

IC FIFO SYNC 2048X18 15NS 64QFP

0

72V3680L6BB8

72V3680L6BB8

Renesas Electronics America

IC FIFO SS 16384X36 6NS 144-BGA

0

7204L30LB

7204L30LB

Renesas Electronics America

IC MEM FIFO 4K X 9 ASYNC 32LCC

0

72T18105L5BBGI

72T18105L5BBGI

Renesas Electronics America

IC FIFO 131X18 2.5V 5NS 240BGA

0

72T18105L5BBI

72T18105L5BBI

Renesas Electronics America

IC FIFO 131X18 2.5V 5NS 240BGA

0

72221L15PFGI

72221L15PFGI

Renesas Electronics America

IC FIFO SYNC 1KX9 15NS 32QFP

0

72V3650L7-5BBI

72V3650L7-5BBI

Renesas Electronics America

IC FIFO SS 2048X36 7-5NS 144BGA

0

72V3632L10PFG8

72V3632L10PFG8

Renesas Electronics America

IC FIFO 512X36X2 SYNC 120TQFP

0

72V36100L6BB

72V36100L6BB

Renesas Electronics America

IC FIFO 64X36 6NS 144BGA

0

72V3632L15PFGI

72V3632L15PFGI

Renesas Electronics America

IC FIFO 512X36X2 SYNC 120TQFP

0

72V243L7-5BC

72V243L7-5BC

Renesas Electronics America

IC FIFO 2048X18 7-5NS 100BGA

0

5962-8753103XA

5962-8753103XA

Renesas Electronics America

CDIP 37.20X15.24X1.65 MM, 2.54MM

0

72V3690L7-5BB

72V3690L7-5BB

Renesas Electronics America

IC FIFO SS 32768X36 7-5N 144BGA

0

72221L15PFGI8

72221L15PFGI8

Renesas Electronics America

IC FIFO SYNC 1KX9 15NS 32QFP

0

72T18115L5BBI

72T18115L5BBI

Renesas Electronics America

IC FIFO 262KX18 2.5V 5NS 240BGA

0

5962-8956807XA

5962-8956807XA

Renesas Electronics America

CDIP 37.20X15.24X1.65 MM, 2.54MM

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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