Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
M66258FP#DF0T

M66258FP#DF0T

Renesas Electronics America

M66258FP FIFO, 8KX8

3000

72V275L15TFGI

72V275L15TFGI

Renesas Electronics America

IC FIFO SS 32768X18 15NS 64STQFP

0

72V293L7-5BCI

72V293L7-5BCI

Renesas Electronics America

IC FIFO 65536X18 7-5NS 100BGA

0

72V251L15JGI8

72V251L15JGI8

Renesas Electronics America

IC FIFO SYNC 4096X18 15NS 32PLCC

0

72T7295L4-4BB

72T7295L4-4BB

Renesas Electronics America

IC FIFO 32768X72 4-4NS 324-BGA

0

7202LA20LB

7202LA20LB

Renesas Electronics America

IC MEM FIFO 1024X9 ASYNC 32LCC

0

72T36115L5BBI

72T36115L5BBI

Renesas Electronics America

IC FIFO 131KX36 5NS 240BGA

0

72V241L15PFGI

72V241L15PFGI

Renesas Electronics America

IC MEM FIFO 4KX9 32QFP

0

72T36125L5BBGI

72T36125L5BBGI

Renesas Electronics America

IC FIFO 524X18 5NS 240BGA

0

72T36105L4-4BB

72T36105L4-4BB

Renesas Electronics America

IC FIFO 131X18 4-4NS 240BGA

0

72T18105L6-7BB

72T18105L6-7BB

Renesas Electronics America

IC FIFO 131X18 2.5V 6-7NS 240BGA

0

7205L30LB8

7205L30LB8

Renesas Electronics America

IC MEM FIFO 8K X 9 ASYNC 32LCC

0

72T36105L6-7BB

72T36105L6-7BB

Renesas Electronics America

IC FIFO 131X18 6-7NS 240BGA

0

72211L15JGI8

72211L15JGI8

Renesas Electronics America

PLCC 13.97X11.43X2.79 MM, 1.27MM

0

72251L10JG

72251L10JG

Renesas Electronics America

IC MEM FIFO 512X9 32PLCC

0

72T72115L5BB

72T72115L5BB

Renesas Electronics America

IC FIFO 131072X72 5NS 324-BGA

37

72V283L6PFG

72V283L6PFG

Renesas Electronics America

IC MEM FIFO 32768X18 80QFP

0

723631L20PFGI

723631L20PFGI

Renesas Electronics America

IC FIFO SYNC 512X36 120-TQFP

0

72T36135ML6BB

72T36135ML6BB

Renesas Electronics America

IC FIFO 1MX18 6NS 240BGA

0

723622L15PFG8

723622L15PFG8

Renesas Electronics America

IC FIFO SYNC 120QFP

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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