Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72T18105L10BB

72T18105L10BB

Renesas Electronics America

IC FIFO 131X18 2.5V 10NS 24BGA

0

72T36125L6-7BB

72T36125L6-7BB

Renesas Electronics America

IC FIFO 524X18 6-7NS 240BGA

0

5962-8956806UA

5962-8956806UA

Renesas Electronics America

CDIP 37.72X7.62X3.56 MM, 2.54MM

0

72V2111L15PFGI8

72V2111L15PFGI8

Renesas Electronics America

IC FIFO SS 512X9 15NS 64QFP

0

72V283L7-5BCI

72V283L7-5BCI

Renesas Electronics America

IC FIFO 32768X18 7-5NS 100-BGA

0

72V3670L7-5BB

72V3670L7-5BB

Renesas Electronics America

IC FIFO SS 8192X36 7-5NS 144BGA

0

72V801L15PFGI

72V801L15PFGI

Renesas Electronics America

IC SYNC FIFO 256X9 15NS 64QFP

0

72V3680L6BBG

72V3680L6BBG

Renesas Electronics America

IC FIFO SS 16384X36 6NS 144-BGA

0

72V293L6BC

72V293L6BC

Renesas Electronics America

IC FIFO 65536X18 6NS 100BGA

0

72V243L7-5PFGI8

72V243L7-5PFGI8

Renesas Electronics America

IC FIFO 2048X18 7-5NS 80QFP

0

72V3611L15PFG

72V3611L15PFG

Renesas Electronics America

IC FIFO SYNC 64X36 15NS 120TQFP

0

72201L15JGI8

72201L15JGI8

Renesas Electronics America

IC MEM FIFO 256X9 32-PLCC

0

72V3680L7-5BB8

72V3680L7-5BB8

Renesas Electronics America

IC FIFO SS 16384X36 7-5NS 144BGA

0

72V3670L7-5BB8

72V3670L7-5BB8

Renesas Electronics America

IC FIFO SS 8192X36 7-5NS 144BGA

0

72V3680L7-5BBI

72V3680L7-5BBI

Renesas Electronics America

IC FIFO SS 16384X36 7-5NS 144BGA

0

72V3650L6BB

72V3650L6BB

Renesas Electronics America

IC FIFO SS 2048X36 6NS 144-BGA

0

72V811L15PFGI

72V811L15PFGI

Renesas Electronics America

IC FIFO SYNC 512X9 15NS 64QFP

0

72T18125L4-4BB

72T18125L4-4BB

Renesas Electronics America

IC FIFO 524X18 2.5V 4NS 240BGA

0

72V243L6BCG

72V243L6BCG

Renesas Electronics America

IC FIFO 2048X18 6NS 100BGA

0

72T7295L10BB

72T7295L10BB

Renesas Electronics America

IC FIFO 32768X72 10NS 324-BGA

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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