Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72V3643L10PFG

72V3643L10PFG

Renesas Electronics America

IC MEM FIFO 1024X36 128TQFP

0

72265LA10TFG8

72265LA10TFG8

Renesas Electronics America

IC FIFO 8KX18 LP 10NS 64QFP

0

72V03L15JG8

72V03L15JG8

Renesas Electronics America

IC ASYNCH 2048X9 15NS 32-PLCC

0

72V245L10TFG

72V245L10TFG

Renesas Electronics America

IC FIFO SYNC 4096X18 10NS 64QFP

0

72831L10PFG8

72831L10PFG8

Renesas Electronics America

IC FIFO SYNC DUAL 2048X9 64-TQFP

0

72V85L15PAG8

72V85L15PAG8

Renesas Electronics America

IC FIFO ASYNCH 4096X18 56TSSOP

0

72V02L25JGI

72V02L25JGI

Renesas Electronics America

IC FIFO ASYNCH 1KX9 25NS 32PLCC

0

7204L20LB8

7204L20LB8

Renesas Electronics America

IC MEM FIFO 4K X 9 ASYNC 32LCC

0

72V255LA15PFGI

72V255LA15PFGI

Renesas Electronics America

IC FIFO SS 8192X18 15NS 64TQFP

0

72T18105L5BB

72T18105L5BB

Renesas Electronics America

IC FIFO 131X18 2.5V 5NS 240BGA

0

72205LB10PFG8

72205LB10PFG8

Renesas Electronics America

IC FIFO 256X18 SYNC 10NS 64-TQFP

0

7205L15JGI8

7205L15JGI8

Renesas Electronics America

IC FIFO 4096X18 15NS 32PLCC

0

72T7285L6-7BB

72T7285L6-7BB

Renesas Electronics America

IC FIFO 16384X72 6-7NS 324-BGA

0

72V3650L7-5BB8

72V3650L7-5BB8

Renesas Electronics America

IC FIFO SS 2048X36 7-5NS 144BGA

0

72V3640L7-5BB

72V3640L7-5BB

Renesas Electronics America

IC FIFO SS 1024X36 7-5NS 144BGA

0

5962-9167703MXA

5962-9167703MXA

Renesas Electronics America

CDIP 37.20X15.24X1.65 MM, 2.54MM

0

72V3660L7-5BB

72V3660L7-5BB

Renesas Electronics America

IC FIFO SS 4096X36 7-5NS 144BGA

0

72221L15JGI8

72221L15JGI8

Renesas Electronics America

IC FIFO SYNC 1KX9 15NS 32PLCC

0

72V3670L6BB

72V3670L6BB

Renesas Electronics America

IC FIFO SS 8192X36 6NS 144-BGA

0

5962-8956806ZA

5962-8956806ZA

Renesas Electronics America

LCC 11.40X13.97X1.78 MM, 1.27MM

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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