Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72225LB15TFGI

72225LB15TFGI

Renesas Electronics America

IC FIFO 1024X18 SYNC 15NS 64TQFP

0

72V271LA15PFGI

72V271LA15PFGI

Renesas Electronics America

IC FIFO SS 16384X18 15NS 64QFP

0

CY7C4221-25JC

CY7C4221-25JC

Rochester Electronics

FIFO, 1KX9, 15NS, SYNCHRONOUS

7457

CY7C4241-15JCT

CY7C4241-15JCT

Rochester Electronics

FIFO, 4KX9, 10NS, SYNCHRONOUS

750

CY7C4271V-10JXC

CY7C4271V-10JXC

IR (Infineon Technologies)

FIFO, 32KX9, 8NS, SYNCHRONOUS

0

CD74HC40105E

CD74HC40105E

FIFO, 16X4, 2250NS, SYNCHRONOUS

12198

67C4013-15NL

67C4013-15NL

FIFO, 64X4, ASYNCHRONOUS

2776

SN74ALVC3641-20PCB

SN74ALVC3641-20PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX36

251

SN74V3640-6PEU

SN74V3640-6PEU

Texas Instruments

FIFO, 1KX36, 4.5NS, SYNCHRONOUS

576

74HC40105PW,112

74HC40105PW,112

Nexperia

FIFO, 16X4, 600NS, ASYNCHRONOUS,

5114

SN74V3690-7PEU

SN74V3690-7PEU

Texas Instruments

FIFO, 32KX36, 5NS, SYNCHRONOUS

736

7282L12PAG8

7282L12PAG8

Renesas Electronics America

IC FIFO 1KX9 12NS 56TSSOP

0

74HC40105DB,112

74HC40105DB,112

Nexperia

FIFO, 16X4, 600NS

2663

CY7C419-10JC

CY7C419-10JC

IR (Infineon Technologies)

FIFO, 256X9, 10NS, ASYNCHRONOUS

0

7285L15PAGI

7285L15PAGI

Renesas Electronics America

IC FIFO 4096X18 15NS 56TSSOP

0

SN74ABT7820-15PN

SN74ABT7820-15PN

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

12556

72V05L15JG

72V05L15JG

Renesas Electronics America

IC FIFO ASYNCH 4096X18 32PLCC

551

SN74V3680-15PEU

SN74V3680-15PEU

Texas Instruments

IC 16384X36 FIFO MEMORY 128LQFP

0

72V265LA15TFGI

72V265LA15TFGI

Renesas Electronics America

IC FIFO SS 16384X18 15NS 64STQFP

0

SN74ALS235N

SN74ALS235N

Texas Instruments

FIFO, 64X5, 22NS, ASYNCHRONOUS

257

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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