Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72235LB10JG

72235LB10JG

Renesas Electronics America

IC FIFO 2048X18 SYNC 10NS 68PLCC

0

QS723661-30TF

QS723661-30TF

FIFO, 4KX36, 30NS, SYNCHRONOUS

0

72V3631L15PFG

72V3631L15PFG

Renesas Electronics America

IC FIFO SYNC 512X36 15NS 120TQFP

0

72V263L6PFG

72V263L6PFG

Renesas Electronics America

IC FIFO 8192X18 6NS 80QFP

0

SN74V215-20PAG

SN74V215-20PAG

Texas Instruments

SN74V215 512 X 18 SYNCHRONOUS FI

0

72V251L10JG

72V251L10JG

Renesas Electronics America

IC FIFO SYNC 4096X18 10NS 32PLCC

0

CY7C4215-25AC

CY7C4215-25AC

Rochester Electronics

FIFO, 512X18, 15NS, SYNCHRONOUS

569

SN74V263-7PZA

SN74V263-7PZA

Texas Instruments

FIFO, 8KX18, 5NS, SYNCHRONOUS

137

SN74ACT7204L20NP

SN74ACT7204L20NP

Texas Instruments

FIFO, 4KX9, ASYNCHRONOUS PDIP28

1946

CY7C425-15JXC

CY7C425-15JXC

IR (Infineon Technologies)

FIFO, 1KX9, 15NS, ASYNCHRONOUS

190

72V84L15PAG

72V84L15PAG

Renesas Electronics America

IC FIFO ASYNCH 2048X18 56TSSOP

0

SN74ALVC3631-15PCB

SN74ALVC3631-15PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

40

7201LA12TPG

7201LA12TPG

Renesas Electronics America

IC MEM FIFO 512X9 12NS 28DIP

8

SN74ACT7201LA35DV

SN74ACT7201LA35DV

Texas Instruments

FIFO MEM ASYNC 512 X 9

990

SN74ACT3641-20PQ

SN74ACT3641-20PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX36

228

SN74ABT3614-30PCB

SN74ABT3614-30PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 64X36, 15NS

514

QS723620-20PF

QS723620-20PF

QUALITY SEMI FIFO 1KX36 SYNC

459

CD40105BE

CD40105BE

4-BIT X 16 FIFO BUFFER REGISTER

5677

QS72215-20J

QS72215-20J

FIFO, 512X18, 12NS, SYNCHRONOUS

445

72V36110L7-5BBGI

72V36110L7-5BBGI

Renesas Electronics America

IC FIFO 131KX36 7-5NS 144BGA

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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