Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72V221L15PFG8

72V221L15PFG8

Renesas Electronics America

IC FIFO SYNC 1KX9 15NS 32QFP

0

SN74ACT3632-30PCB

SN74ACT3632-30PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

2390

CY7C74-40PC

CY7C74-40PC

CY7C74-40PC

0

72V275L15PFGI

72V275L15PFGI

Renesas Electronics America

IC FIFO SS 32768X18 15NS 64-TQFP

0

SN74ACT7201LA20DV

SN74ACT7201LA20DV

Texas Instruments

FIFO, 512X9, ASYNCHRONOUS PDSO28

1679

CY7C4221V-15JC

CY7C4221V-15JC

Rochester Electronics

FIFO, 1KX9, 11NS, SYNCHRONOUS

315

72V3650L6PFG8

72V3650L6PFG8

Renesas Electronics America

IC FIFO SS 2048X36 6NS 128-TQFP

0

CY7C4292V-25ASC

CY7C4292V-25ASC

Rochester Electronics

FIFO, 128KX9, 15NS, SYNCHRONOUS

1344

7202LA15TPGI

7202LA15TPGI

Renesas Electronics America

IC FIFO ASYNC 1KX9 15NS 28DIP

0

7207L20DB

7207L20DB

Renesas Electronics America

IC MEM FIFO 32K X 9 ASYNC 28CDIP

0

SN74ACT7203L25RJ

SN74ACT7203L25RJ

Texas Instruments

FIFO, 2KX9, 25NS, ASYNCHRONOUS

1295

SN74ACT7204L35NP

SN74ACT7204L35NP

Texas Instruments

FIFO, 4KX9, ASYNCHRONOUS PDIP28

2300

CY7C4201V-15AXC

CY7C4201V-15AXC

Flip Electronics

FIFO 256 X9 LO VLTG SYNC FIFO CO

0

4703BDM

4703BDM

FIFO, 16X4, ASYNCHRONOUS, CMOS

3424

7201LA15JG

7201LA15JG

Renesas Electronics America

IC FIFO ASYNC 512X9 15NS 32-PLCC

161

QS7203-35P

QS7203-35P

FIFO, 2KX9, 35NS, ASYNCHRONOUS

368

72241L10JG8

72241L10JG8

Renesas Electronics America

IC FIFO 2048X18 SYNC 10NS 32PLCC

0

SN74ALVC7813-20DL

SN74ALVC7813-20DL

Texas Instruments

FIFO, 64X18, 13NS, SYNCHRONOUS

2535

7201LA12PDG

7201LA12PDG

Renesas Electronics America

IC MEM FIFO 512X9 12NS 28DIP

0

SN74ACT7807-20PAG

SN74ACT7807-20PAG

Texas Instruments

FIFO, 2KX9, 13NS, SYNCHRONOUS

2936

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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