Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
CY7C429-15JXC

CY7C429-15JXC

IR (Infineon Technologies)

FIFO, 2KX9, 15NS, ASYNCHRONOUS

407

7203L12JG8

7203L12JG8

Renesas Electronics America

IC MEM FIFO 2048X9 12NS 32-PLCC

0

SN74ACT7201LA50RJ

SN74ACT7201LA50RJ

Texas Instruments

FIFO, 512X9, 50NS, ASYNCHRONOUS

4133

QS7224-30V

QS7224-30V

QUALITY SEMI FIFO 4KX9 13NS SYNC

331

7284L12PAG8

7284L12PAG8

Renesas Electronics America

IC MEM FIFO 2048X18 56TSSOP

0

SN74ACT7206L50NP

SN74ACT7206L50NP

Texas Instruments

FIFO, 16KX9, 50NS, ASYNCHRONOUS

3086

QS723621-25TF

QS723621-25TF

QUALITY SEMI BI-DIR FIFO 2KX36

448

QS7201-50V

QS7201-50V

QUALITY SEMI FIFO 512X ASYNC

1560

72V845L10PFG

72V845L10PFG

Renesas Electronics America

IC FIFO SYNC 4096X18 128QFP

0

72V3660L7-5PFGI

72V3660L7-5PFGI

Renesas Electronics America

IC FIFO SS 4096X36 7-5NS 128TQFP

0

QS7202-50SO

QS7202-50SO

FIFO, 1KX9, 50NS, ASYNCHRONOUS

194

CY7C4245-10AXC

CY7C4245-10AXC

IR (Infineon Technologies)

FIFO, 4KX18, 8NS, SYNCHRONOUS

4287

72V2103L6PFG

72V2103L6PFG

Renesas Electronics America

IC FIFO SUPERSYNCII 6NS 80-TQFP

0

SN74ALVC7805-20DLR

SN74ALVC7805-20DLR

Texas Instruments

FIFO, 256X18, 13NS, SYNCHRONOUS

4500

SN74ALS232BFN

SN74ALS232BFN

Texas Instruments

FIFO, 16X4, 30NS, ASYNCHRONOUS

5202

SN74ALS229BDW

SN74ALS229BDW

Texas Instruments

FIFO, 16X5, 30NS, SYNCHRONOUS

2400

723642L15PFG

723642L15PFG

Renesas Electronics America

IC FIFO SYNC 256X36X2 120TQFP

0

CY7C4231V-25AXC

CY7C4231V-25AXC

IR (Infineon Technologies)

FIFO, 2KX9, 15NS, SYNCHRONOUS

20

QS72231-15JR

QS72231-15JR

QUALITY SEMI FIFO 2KX9 10NS SYNC

752

7201LA12JG8

7201LA12JG8

Renesas Electronics America

IC MEM FIFO 512X9 12NS 32-PLCC

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

RFQ BOM Call Skype Email
Top